EMI-Shielded SiP with Integrated Capacitive Touch Pad
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Solution Overview
Problem
Electronic devices with systems-in-packages face challenges with electromagnetic interference (EMI) and the complexity of integrating capacitive touch sensors, as existing solutions either fail to effectively shield against EMI or require external sensors, increasing manufacturing costs and complexity.
Innovation Solution
Incorporating EMI shielding within the system-in-package that also functions as a capacitive sensing pad, using a molding compound with vias to connect the sensing pad to a capacitive sensor, allowing for internal capacitive touch sensing without external components, thereby reducing device footprint and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EMI shielding is added to protect components from electromagnetic interference, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines EMI shielding and capacitive touch sensing functions into a single integrated structure. The EMI shield is merged with the capacitive sensing pad, allowing both electromagnetic protection and touch detection to be performed by the same component, thereby reducing overall device complexity while maintaining reliability.
Solution Approach 2:
The EMI shielding structure is designed to serve multiple functions: it provides electromagnetic interference protection for internal components while simultaneously acting as a capacitive sensing pad for touch detection. This multi-functionality eliminates the need for separate shielding and sensing components, reducing device complexity.
2Reliability
If capacitive touch sensors are placed outside the system-in-package, then sensing capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates the capacitive touch sensor within the system-in-package by merging it with the EMI shielding structure. This eliminates the need for external sensors and reduces manufacturing complexity while maintaining full touch sensing capability through the integrated sensing pad.
Solution Approach 2:
The EMI shielding structure serves itself by also functioning as the capacitive sensing pad. The same structure that protects internal components from EMI also detects touch inputs, eliminating the need for separate sensing components and simplifying manufacturing.
3Strength
If the system-in-package is sealed in molding compound, then protection is improved, but sensor access to ambient environment is blocked
Solution Approach 1:
The EMI shielding structure serves multiple functions: it provides electromagnetic protection when sealed in the molding compound while simultaneously extending beyond the package to form a capacitive sensing pad that accesses the ambient environment for touch detection, thus maintaining both protection and sensor access.
Solution Approach 2:
The sensing pad extends in a different dimension beyond the sealed package boundary. While the internal components are protected within the molding compound, the sensing pad protrudes outward to interact with the ambient environment, allowing touch sensing without compromising package sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively shields against EMI, reduces manufacturing costs, and enables internal capacitive touch sensing, enhancing the electrical performance and user interaction capabilities of electronic devices like smartphones and wearables.
Implementation Method 1
an EMI shielding that forms a sensing pad and that is in electrical communication with a sensor, such as a capacitive sensor
Implementation Method 2
capacitive sensor that may be in electrical communication with the EMI shielding which may form one or more sensing pads for detecting user interaction
Data Source
AI summary
Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.