Semiconductor Package EMI Shielding for Wire Sweep and ESD
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Solution Overview
Problem
Conventional wire bonding packaging techniques face issues with bonding wire sweep during encapsulation, leading to wire deformation and shorting, and there is a need for effective EMI shielding and ESD protection in semiconductor packages.
Innovation Solution
The implementation of insulator-coated bonding wires and a package-level EMI shielding structure, including a component with a metal layer acting as a Faraday cage, to stabilize wires and shield against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional wire bonding packaging technique is used with increasing number of I/O terminal pads, then the pitch between adjacent bonding wires becomes finer, but bonding wire sweep and deformation occur during encapsulation leading to shorting
Solution Approach 1:
The patent applies preliminary action by coating the bonding wires with insulator material before the encapsulation process. This pre-protection measure prevents wire deformation and shorting during molding, allowing finer pitch wiring to maintain its precision throughout manufacturing.
Solution Approach 2:
The insulator coating acts as an intermediary layer between the bonding wires and the molding compound. This intermediate protective layer reduces direct mechanical interaction between the molding forces and the wires, preventing sweep and deformation while allowing the fine pitch configuration to be maintained.
2Manufacturing precision
If additional process steps or specialized equipment are used to reduce bonding wire sweep, then wire deformation is reduced, but production costs increase
Solution Approach 1:
The patent merges the insulator coating application with the existing wire bonding process flow, eliminating the need for separate specialized equipment or additional process steps. The insulator material is applied as part of the standard packaging sequence, reducing complexity while maintaining wire stability.
Solution Approach 2:
The insulator coating provides self-service protection to the bonding wires, enabling them to resist molding forces without requiring external specialized equipment or additional process interventions. This self-protective mechanism reduces manufacturing complexity and cost.
3Productivity
If plastic molding compound melt flows into mold cavity during encapsulation, then packaging is completed, but forces exerted displace or deform bonding wires causing shorting
Solution Approach 1:
The insulator coating serves as beforehand cushioning protection for the bonding wires before the encapsulation process begins. This pre-applied protective layer absorbs and distributes the molding forces, preventing direct transmission of stress to the wires and maintaining their integrity during productivity-critical encapsulation.
Solution Approach 2:
The insulator coating functions as a thin film protective shell around the bonding wires. This flexible protective layer allows the wires to maintain their shape and position while withstanding the molding forces, ensuring reliability during the encapsulation process that completes packaging.
4Shape
If adjacent bond wires come into contact during encapsulation, then wire deformation occurs, but shorting between adjacent wires results
Solution Approach 1:
The insulator coating acts as an intermediary electrical isolation layer between adjacent bonding wires. This intermediate insulating barrier prevents electrical contact and shorting even when wires are in close proximity or experience minor deformations during encapsulation, maintaining reliability while preserving wire shape.
Solution Approach 2:
The insulator coating provides localized electrical isolation properties at critical points where wire contact could occur. This local quality enhancement ensures electrical separation is maintained precisely where needed, preventing shorting while allowing the overall wire shape to remain intact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents wire shorting and enhances EMI shielding, providing mechanical support and protection against ESD, resulting in a more stable and efficient semiconductor package.
Implementation Method 1
insulator-coated bonding wires... to stabilize wires and shield against electromagnetic interference
Implementation Method 2
a component with a metal layer acting as a Faraday cage, to stabilize wires and shield against electromagnetic interference
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A semiconductor package includes a carrier substrate (10) having a top surface (10a); a semiconductor die (20) mounted on the top surface (10a); a plurality of first bonding wires (31) connecting the semiconductor die (20) to the carrier substrate (10); an insulating material (41) encapsulating the plurality of first bonding wires (31); a component (200) having a metal layer (204) mounted on the insulating material (41); a plurality of second bonding wires (32) connecting the metal layer (204) of the component (200) to the carrier substrate (10); and a molding compound (50) covering the top surface (10a) of the carrier substrate (10) and encapsulating the semiconductor die (20), the component (200), the plurality of first bonding wires (31), the plurality of second bonding wires (32), and the insulating material (50). The metal layer (204) and the plurality of second bonding wires (32) constitute an electromagnetic interference, EMI, shielding structure.