Partial EMI Shielding Structure for Antenna-Ready Semiconductor Packages
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Solution Overview
Problem
Conformal EMI shielding in semiconductor devices, while effective, poses challenges for transceiver components that require electromagnetic radiation for communication, as it reduces the magnitude of all electromagnetic radiation, including desired signals.
Innovation Solution
The implementation of partial EMI shielding in semiconductor packages, where the shielding is selectively applied over the top and side surfaces, leaving areas exposed for transceiver components to function without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conformal EMI shielding is applied over the entire semiconductor device, then electromagnetic interference protection is improved, but transceiver antenna functionality deteriorates due to blocked electromagnetic radiation
Solution Approach 1:
The EMI shielding is segmented into specific regions rather than applied uniformly across the entire device. The shielding is divided into a first region over the semiconductor package and a second region over the transceiver antenna, allowing differential treatment of different functional areas.
Solution Approach 2:
Different regions of the semiconductor device are assigned different shielding qualities. The semiconductor package region receives full EMI shielding while the transceiver antenna region remains substantially free of shielding to maintain its electromagnetic radiation capability.
2Object-affected harmful factors
If conformal EMI shielding is applied over the semiconductor package, then EMI protection is improved, but the device complexity increases due to additional manufacturing steps
Solution Approach 1:
A mask layer is applied in advance before the EMI shielding deposition process. This mask layer is strategically positioned to prevent shielding material from depositing in the transceiver antenna region while allowing deposition over the semiconductor package region.
Solution Approach 2:
A mask layer serves as an intermediary element during the shielding manufacturing process. This temporary component enables selective shielding application and is subsequently removed, leaving the desired partial shielding pattern without requiring complex direct deposition control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective EMI protection of semiconductor packages while maintaining the ability of transceiver components to transmit and receive electromagnetic signals, thereby enhancing the performance and functionality of electronic devices.
Implementation Method 1
a first region with an EMI shielding layer formed over a top surface of the semiconductor package and over a side surface of the semiconductor package, and a second region with an opening in the EMI shielding layer to expose the antenna
Data Source
AI summary
A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.