Semiconductor Package EMI Shielding via Conductive Coating
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Solution Overview
Problem
Semiconductor device packages face challenges with electromagnetic interference (EMI) due to high clock speeds and smaller sizes, leading to increased electromagnetic emissions, and existing shielding solutions like conductive casings are prone to peeling and require precise matching, making them costly and time-consuming to manufacture.
Innovation Solution
A semiconductor device package design featuring a circuit substrate with a conductive layer and grounding ring, where a conductive coating is applied to the encapsulant and exposed grounding ring, eliminating the need for an extra metal casing and allowing for efficient EMI shielding without precise size and shape matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive casing is used for EMI shielding, then EMI reduction is achieved, but the casing is prone to peeling or falling off due to adhesive degradation from temperature and humidity
Solution Approach 1:
The patent merges the EMI shielding function directly into the encapsulant material by incorporating conductive particles or fibers into the encapsulant compound. This integration eliminates the separate casing component and its adhesive bonding requirements, while maintaining effective EMI shielding through the conductive network within the encapsulant matrix.
Solution Approach 2:
The patent uses composite materials by combining the encapsulant polymer matrix with conductive fillers (such as metal particles, carbon fibers, or conductive oxides) to create a material that simultaneously provides mechanical protection and EMI shielding. This composite approach achieves both structural integrity and electromagnetic interference protection without requiring additional components.
2Object-affected harmful factors
If an electrically conductive casing is used for EMI shielding, then EMI reduction is achieved, but precise matching of size and shape between casing and package is required, rendering manufacturing costly and time consuming
Solution Approach 1:
The patent combines the EMI shielding function with the encapsulant that already conforms to the package geometry. Since the encapsulant is molded directly onto the semiconductor device, it automatically achieves the required size and shape match without requiring separate casing components or precision alignment operations.
Solution Approach 2:
The encapsulant serves multiple functions simultaneously: mechanical protection, environmental sealing, and EMI shielding. This multi-functionality eliminates the need for separate protective components and their associated manufacturing steps, simplifying the overall manufacturing process.
3Object-affected harmful factors
If an electrically conductive casing is used for EMI shielding, then EMI reduction is achieved, but different packages require different casings, further increasing manufacturing cost and time
Solution Approach 1:
The encapsulant is designed to accommodate different semiconductor device geometries through variations in the molding process. The same basic encapsulant material and process can be adapted to different package sizes and shapes, providing universal EMI shielding capability across multiple package types without requiring different casing designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces EMI by establishing a large contact area for the conductive coating, enhancing reliability and shielding efficacy while simplifying manufacturing by eliminating the need for precise casing alignment and reducing manufacturing costs.
Implementation Method 1
When electromagnetic emissions from an interior of the package strike an inner surface of the casing, at least a portion of these emissions can be electrically shorted, thereby reducing the level of emissions that can pass through the casing and adversely affect neighboring semiconductor devices.
Implementation Method 2
The conductive coating is applied to the encapsulant and the grounding ring.
Data Source
AI summary
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an encapsulant, and a conductive coating. The circuit substrate includes a carrying surface, a bottom surface, a lateral surface extending between the carrying surface and the bottom surface, a conductive layer, and a grounding ring. The grounding ring is in a substantially continuous pattern extending along a border of the circuit substrate, is exposed at a lateral surface of the circuit substrate, and is included in the conductive layer. The electronic device is disposed adjacent to the carrying surface and is electrically connected to the conductive layer of the circuit substrate. The encapsulant is disposed adjacent to the carrying surface and encapsulates the electronic device. The conductive coating is applied to the encapsulant and the grounding ring.