EMI Shielding Structure with Differential Surface Roughness

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Solution Overview

Problem

Existing electromagnetic interference (EMI) shielding technologies using metal members face challenges in covering large areas effectively, leading to performance degradation and malfunction due to incomplete shielding and EMI leaks, particularly on printed circuit boards.

Innovation Solution

An electromagnetic wave shielding structure with a surface roughness differential between its upper and lateral sides, combined with a metal layer formed by patterning multiple metal layers, including Cu and Ni, to enhance adhesion and prevent EMI leaks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal member is used for EMI shielding, then shielding coverage is provided, but the area to be covered becomes large and adjacent elements are covered unnecessarily

Engineering Contradiction:
ImproveEMI shielding effectivenessVSAvoidshielding structure area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent applies different surface roughness characteristics to different regions of the shielding structure. The first surface (facing the electromagnetic wave source) has a specific roughness range (1-30 μm) to optimize wave reflection, while the second surface has a different roughness range (0.1-10 μm) for optimal adhesion and sealing. This local differentiation allows the shielding structure to be more compact and targeted, covering only the necessary area around the electronic component without extending to adjacent elements.

Inventive Principle:
Principle #3Local quality

2Reliability

If complete EMI shielding is implemented, then shielding performance is improved, but EMI leaks occur at the printed circuit board surface and engagement portions

Engineering Contradiction:
ImproveEMI shielding completenessVSAvoidEMI leak at engagement portions
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the surface roughness parameter of the shielding structure to resolve EMI leakage issues. By optimizing the surface roughness within specific ranges (1-30 μm for the first surface, 0.1-10 μm for the second surface), the structure achieves better electromagnetic wave reflection and improved adhesion to the printed circuit board. This parameter optimization eliminates gaps and engagement portion leaks, achieving complete EMI shielding without unnecessary coverage expansion.

Inventive Principle:
Principle #35Parameter changes

3Area of stationary object

If the shielding structure is made compact, then coverage area is reduced, but shielding effectiveness may be compromised

Engineering Contradiction:
Improveshielding structure areaVSAvoidshielding effectiveness
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent employs a composite shielding structure with multiple metal layers having different surface roughness characteristics. This composite structure achieves high shielding effectiveness in a compact form by combining the electromagnetic wave reflection properties of rough surfaces with the adhesion and sealing properties of smoother surfaces. The multi-layer composite design maximizes shielding performance within a minimized area, preventing EMI leakage at engagement portions while maintaining compact dimensions.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively minimizes performance degradation and malfunction by maximizing EMI shielding efficiency, reducing blister and side slipping phenomena, and increasing reliability through a functional layer that fundamentally blocks electromagnetic interference.

Implementation Method 1

an electromagnetic wave shielding metal layer configured to encompass the shielding structure... to fundamentally block an electromagnetic interference (EMI) leak of the electromagnetic waves

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

surface roughness of an upper side of the shielding structure is different from that of a lateral side of the shielding structure... reducing blister and side slipping phenomena

Methodology Applied
Scientific EffectSurface adhesion: Adhesive

Data Source

PatentUS10257969B2Electromagnetic wave shielding structure
Publication Date: 2019.04.09 LG INNOTEK CO LTD
  • US10257969B2 patent drawing
  • US10257969B2 patent drawing
  • US10257969B2 patent drawing

AI summary

According to an embodiment, provided is an electromagnetic wave shielding structure comprising: a shielding structure encompassing an electromagnetic wave generation source, and having a surface roughness on a surface thereof; and an electromagnetic wave shielding metal layer arranged on the surface of the shielding structure so as to encompass the shielding structure, wherein the upper side and the lateral side of the shielding structure have different surface roughness.