Prefabricated EMI Shielding Frame with Penetrable Material Cavities
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Solution Overview
Problem
Semiconductor devices face challenges in effectively shielding against electromagnetic interference (EMI) and radio frequency interference (RFI) due to the generation of undesired inter-device interference, which can disrupt device operation, especially in high-frequency applications, and existing shielding methods are costly and prone to die shifting issues during manufacturing.
Innovation Solution
A prefabricated EMI shielding frame with cavities containing penetrable material is mounted over the semiconductor die, featuring a plate with openings to allow excess encapsulant to escape, providing effective shielding while reducing manufacturing costs and die shifting through the use of a shielding frame with integrated bodies defining cavities and a penetrable material that is deposited and cured to form a hardened state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conformal shielding layer is applied over the encapsulant, then EMI shielding is achieved, but manufacturing costs increase due to specialized equipment requirements
Solution Approach 1:
The shielding structure is segmented into a frame configuration rather than a continuous conformal layer. The shielding frame consists of a plate and side walls that are positioned around the semiconductor die, creating discrete shielding zones. This segmentation allows the shielding function to be achieved without requiring specialized conformal deposition equipment, as the frame can be manufactured using standard fabrication processes and then attached to the die.
Solution Approach 2:
The shielding frame acts as an intermediary structure between the semiconductor die and the external environment. Rather than directly applying a conformal shielding layer to the encapsulant, the frame is positioned around the die and encapsulated together, providing EMI shielding through its conductive structure. This intermediary approach simplifies manufacturing by avoiding the need for complex conformal deposition processes.
2Object-affected harmful factors
If a conformal shielding layer is applied over the encapsulant, then EMI shielding is achieved, but die shifting occurs during encapsulant deposition
Solution Approach 1:
The shielding frame is attached to the semiconductor die before the encapsulant deposition process. This preliminary attachment provides structural support and positioning stability to the die during subsequent manufacturing steps. The frame acts as a mechanical constraint that prevents die shifting when the encapsulant is deposited and cured, ensuring alignment accuracy is maintained throughout the manufacturing process.
Solution Approach 2:
The structural support provided by the shielding frame changes the mechanical parameters of the die assembly during encapsulant deposition. The frame increases the rigidity and stability of the structure, altering the physical conditions under which the encapsulant is applied. This parameter change prevents die shifting and maintains precise alignment during the encapsulation process.
3Object-affected harmful factors
If the shielding frame has a solid plate structure, then EMI shielding is effective, but excess encapsulant cannot escape during deposition
Solution Approach 1:
The plate of the shielding frame incorporates openings that allow the encapsulant material to pass through during the deposition process. These openings enable excess encapsulant to escape from the cavity, preventing defects and ensuring complete encapsulation. The plate maintains its EMI shielding function while the openings provide necessary permeability for the encapsulant material during manufacturing.
4Manufacturing precision
If the shielding frame provides structural support, then alignment accuracy is improved, but device complexity increases
Solution Approach 1:
The shielding frame is designed to perform multiple functions simultaneously: it provides EMI shielding through its conductive structure, offers structural support to prevent die shifting, and defines the cavity for encapsulant deposition. By integrating these multiple functions into a single component, the overall device complexity is reduced compared to having separate elements for each function. The frame's multi-functionality simplifies the manufacturing process while maintaining alignment accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks or absorbs EMI and RFI, reduces manufacturing costs by eliminating the need for specialized equipment, and improves alignment accuracy by providing structural support and environmental encapsulation, thereby enhancing the performance and reliability of semiconductor devices.
Implementation Method 1
A penetrable material is deposited in the cavities... and cured to form a hardened state
Implementation Method 2
The shielding frame has a plate and a body integrated with and extending from the plate to define a cavity... effectively blocks or absorbs EMI and RFI
Data Source
AI summary
A semiconductor device has a plurality of semiconductor die mounted to a temporary carrier. A prefabricated shielding frame has a plate and integrated bodies extending from the plate. The bodies define a plurality of cavities in the shielding frame. A penetrable material is deposited in the cavities of the shielding frame. The shielding frame is mounted over the semiconductor die such that the penetrable material encapsulates the die. The carrier is removed. An interconnect structure is formed over the die, shielding frame, and penetrable material. The bodies of the shielding frame are electrically connected through the interconnect structure to a ground point. The shielding frame is singulated through the bodies or through the plate and penetrable material to separate the die. TIM is formed over the die adjacent to the plate of the shielding frame. A heat sink is mounted over the plate of the shielding frame.