Semiconductor Package EMI Shielding Layer Adhesion via Extended Ground Lines
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Solution Overview
Problem
Current semiconductor packages face challenges in effectively addressing electromagnetic interference (EMI) due to inadequate shielding, which can affect electronic circuit performance and human health, and existing solutions do not provide sufficient adhesive strength for EMI shielding layers.
Innovation Solution
The semiconductor package design includes a substrate with internal and extended ground lines that expose end portions at the sidewalls, covered by an EMI shielding layer that contacts these exposed ends, enhancing the adhesive strength and electrical contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an EMI shielding layer is added to cover the molding member, then EMI protection is improved, but adhesive strength between the shielding layer and substrate is insufficient
Solution Approach 1:
The ground line is divided into two segments: an internal ground line portion disposed on the substrate and an extended ground line portion that extends from the internal ground line toward the sidewall. This segmentation allows the extended portion to protrude and provide additional contact area for the EMI shielding layer, thereby improving adhesive strength while maintaining EMI protection functionality.
Solution Approach 2:
The ground line structure transitions from a two-dimensional planar configuration to a three-dimensional structure by extending the ground line vertically toward the sidewall. This dimensional change creates a protruding extended portion that provides both mechanical anchoring for the EMI shielding layer and electrical connection pathways, resolving the adhesive strength issue.
2Object-affected harmful factors
If ground lines are extended to improve EMI shielding effectiveness, then EMI protection is improved, but device complexity increases
Solution Approach 1:
The extended ground line portion serves multiple functions simultaneously: it provides EMI shielding by forming a continuous ground path, enhances adhesive strength by protruding to contact the EMI shielding layer, and establishes electrical connections between different ground regions. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving EMI protection goals.
Data Source
AI summary
Semiconductor packages are provided. In some embodiments, the semiconductor package includes a substrate, a first ground line including a first internal ground line disposed along edges of the substrate and a plurality of first extended ground lines between the first internal ground line and sidewalls of the substrate, a chip on the substrate, a molding member disposed on the substrate to cover the chip, and an electromagnetic interference (EMI) shielding layer covering the molding member, the EMI shielding layer extending along the sidewalls of the substrate and contacting the end portions of the plurality of first extended ground lines. The plurality of first extended ground lines include end portions that are exposed at the sidewalls of the substrate.