Semiconductor Package EMI Shielding With Through-Encapsulant Grounding
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturization and integration density due to the need for smaller and more efficient packaging techniques for semiconductor devices, particularly in bonding semiconductor devices where sophisticated connection processes are required to reduce physical size and improve performance.
Innovation Solution
The solution involves forming a redistribution substrate with conductive vias and layers, attaching multiple modules to the substrate, and using a conductive connector or pillar to facilitate electrical connections, followed by encapsulation and the deposition of a shield through the encapsulant to provide EMI shielding and grounding, allowing for thinner and more cost-effective device designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging techniques are used for semiconductor devices, then the device can be manufactured with standard processes, but the physical size of the semiconductor device becomes larger and EMI shielding requirements increase complexity
Solution Approach 1:
The patent combines the EMI shielding function with the grounding structure by integrating a conductive connector that serves both as an electrical connection element and as part of the shielding mechanism. The shielding layer is deposited directly over the conductive connector, merging these two previously separate functions into a single integrated structure, thereby reducing overall device complexity while maintaining effective EMI protection.
Solution Approach 2:
The patent transitions from traditional backside or lateral side grounding methods to a top-side grounding approach. The conductive connector and shielding structure are formed on the same side as the semiconductor die, utilizing the vertical dimension through the encapsulant rather than requiring separate grounding paths on opposite sides of the device, thus reducing physical size and simplifying the overall packaging architecture.
2Reliability
If backside or lateral side grounding methods are used, then EMI shielding can be provided, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The conductive connector is formed and positioned on the substrate before the semiconductor die is mounted and before the encapsulant is applied. The shielding layer is then deposited over the connector during the same encapsulation process. This preliminary positioning and integration of the grounding and shielding structures simplifies subsequent manufacturing steps compared to methods requiring separate backside or lateral grounding operations.
Solution Approach 2:
The conductive connector serves multiple functions simultaneously: it provides electrical connection to the semiconductor die, establishes a grounding path, and forms part of the EMI shielding structure. This multi-functionality eliminates the need for separate dedicated grounding elements and simplifies the manufacturing process while maintaining EMI shielding effectiveness.
3Productivity
If sophisticated connection processes are used for bonding semiconductor devices, then integration density can be improved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent divides the connection structure into discrete, modular components: a conductive connector formed on the substrate, a semiconductor die mounted on the connector, and an encapsulant that seals and protects the connection. This segmentation allows each component to be optimized and manufactured independently using standard processes, then assembled together, thereby achieving high integration density without requiring overly sophisticated connection processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of smaller, more efficient semiconductor devices with improved EMI shielding and reduced manufacturing costs by eliminating the need for backside or lateral side grounding methods, while maintaining high yield and surface area utilization.
Implementation Method 1
a shield extending through the encapsulant to make physical contact with the conductive connector
Implementation Method 2
depositing a shield layer over the encapsulant and in the opening to make electrical connection with the conductive connector
Data Source
AI summary
Semiconductor devices and method of manufacture are provided. In embodiments a conductive connector is utilized to provide an electrical connection between a substrate and an overlying shield. The conductive connector is placed on the substrate and encapsulated with an encapsulant. Once encapsulated, an opening is formed through the encapsulant to expose a portion of the conductive connector. The shield is deposited through the encapsulant to make an electrical connection to the conductive connector.