Integrated EMI Shielding and Component Guiding Structure
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Solution Overview
Problem
Electronic devices face challenges in securing design space for guiding electronic component arrangement due to the trend towards slim form factors and the need to accommodate various components in limited spaces.
Innovation Solution
An electronic device incorporating a printed circuit board with components on both surfaces, and a metal structure that shields electromagnetic interference (EMI) by covering part of one component and extending through the board to support another component, thereby guiding the arrangement position without additional members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a separate guiding structure is added to guide electronic component arrangement, then the component arrangement precision is improved, but the device complexity and space occupation increase
Solution Approach 1:
The patent combines the electromagnetic shielding function and the component guiding function into a single integrated structure. The shielding plate includes protrusions that extend toward the circuit board, which serve dual purposes: providing EMI shielding and guiding the arrangement position of electronic components. This eliminates the need for separate guiding structures, thereby reducing device complexity while maintaining manufacturing precision.
Solution Approach 2:
The shielding plate is designed to perform multiple functions simultaneously: electromagnetic interference shielding, component arrangement guiding, and structural support. The protrusions on the shielding plate create designated spaces that guide component placement while the plate itself provides EMI protection. This multi-functionality reduces the overall number of components needed in the device.
2Volume of moving object
If various electronic components are disposed in limited space to achieve slim form factor, then the device volume is reduced, but the manufacturing precision and component arrangement difficulty worsen
Solution Approach 1:
The shielding plate features localized protrusions at specific positions that create precise guiding structures for component placement. These protrusions provide local geometric constraints that ensure accurate component arrangement in the limited space available. The localized guiding features enable precise component positioning without requiring the entire device to be larger.
3Manufacturing precision
If additional guiding members are added to guide component arrangement, then the component arrangement precision is improved, but the device cost increases
Solution Approach 1:
The patent integrates the guiding function into the existing shielding plate structure through protrusions, eliminating the need for separate guiding members. This integration reduces the total number of parts that need to be manufactured and assembled, thereby lowering manufacturing costs while maintaining component arrangement precision.
Solution Approach 2:
The shielding plate serves multiple functions including EMI shielding and component guiding, which would otherwise require separate components. By making the shielding plate multi-functional, the patent reduces the bill of materials and assembly complexity, leading to lower manufacturing costs without sacrificing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively guides the arrangement of electronic components while reducing space restrictions and costs, by utilizing an electromagnetic shielding member integrated into the device.
Implementation Method 1
a metal structure configured to shield electromagnetic interference (EMI) related to the first component
Data Source
AI summary
According to the disclosure, an electronic device may include a printed circuit board, a first component disposed on one surface of the printed circuit board, a second component disposed on the other surface of the printed circuit board, and a metal structure configured to shield electromagnetic interference (EMI) related to the first component, wherein the metal structure includes a first portion configured to cover at least a part of the first component, and a second portion configured to extend from the first portion through the printed circuit board so as to support the second component. Various other embodiments may be possible.


