Integrated EMI Shielding and Heat Dissipation Structure

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Solution Overview

Problem

Existing electromagnetic interference (EMI) shielding structures in electronic devices, such as mobile phones, face challenges in effectively dissipating heat generated by circuit elements like AP chips and memory chips, leading to hot spots and increased manufacturing costs due to the use of separate thermal interface materials (TIMs) and metal shields, which also increase device thickness.

Innovation Solution

An EMI shielding structure with an integrated heat dissipation unit, where a heat dissipator is embedded within the shielding layer, utilizing a liquefied volatile material and porous or channel-based structures to efficiently transfer heat to a lower temperature area, eliminating the need for separate TIMs and reducing device thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface materials (TIMs) are used to transfer heat from circuit elements to the metal shield can, then heat transfer efficiency is improved, but device thickness increases and manufacturing complexity increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoiddevice thickness

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

The patent combines the EMI shielding function and heat dissipation function into a single integrated structure. The metal shield can is directly coupled to the heat dissipation unit without requiring separate TIMs, merging two previously separate components (shielding layer and heat dissipation unit) into one unified assembly that performs both electromagnetic shielding and thermal management functions simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The metal shield can structure is designed to serve multiple functions: it provides electromagnetic interference shielding while simultaneously acting as a heat dissipation pathway. By integrating the heat dissipation unit directly with the shielding layer, the same structural component performs both shielding and thermal management roles, eliminating the need for dedicated TIM materials.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If multiple TIMs are disposed between the heat pipe and metal shield can and between the heat pipe and metal frame, then heat transfer efficiency is improved, but the number of manufacturing processes increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidnumber of manufacturing processes

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent merges the thermal interface function into the integrated structure of the metal shield can and heat dissipation unit. By designing the shielding layer to be directly coupled to the heat dissipation unit, the need for multiple separate TIM applications and associated manufacturing processes is eliminated, reducing assembly steps while maintaining effective heat transfer.

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If a metal shield can is used for electromagnetic interference shielding, then EMI shielding performance is improved, but manufacturing cost increases

Engineering Contradiction:

ImproveEMI shielding performanceVSAvoidmanufacturing cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The metal shield can is designed to perform dual functions: electromagnetic interference shielding and heat dissipation. By integrating the heat dissipation unit directly with the shielding layer, the structure eliminates the need for separate TIM materials and reduces the total component count, thereby lowering material costs and manufacturing complexity while maintaining effective EMI shielding performance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively transfers heat away from critical components without increasing device thickness or manufacturing costs, maintaining operational efficiency while preventing hot spots and improving user comfort.

Implementation Method 1

a heat dissipator having a surface adhered to the shielding member and configured to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The inside of the metal shield can is provided with an air gap so that the metal shield can is insulated from the circuit elements. Since the air gap has low thermal conductivity, the heat radiated from the AP chip and the memory chip is not transferred to the metal shield can

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10068832B2EMI shielding structure having heat dissipation unit and method for manufacturing the same

Publication Date: 2018.09.04 SAMSUNG ELECTRONICS CO LTD

AI summary

An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.