EMI Shielding Layer for Microelectronic Packages
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Solution Overview
Problem
Current microelectronic packages face challenges in effectively mitigating electromagnetic interference (EMI) due to the increasing proximity of components, as traditional methods like Faraday cages and magnetic absorber materials either increase product size and cost or are limited in frequency spectrum coverage.
Innovation Solution
A microelectronic package design incorporating an electromagnetic interference shield layer with specific electrical conductivity (between 10,000 and 100,000 siemens per meter) that contacts the microelectronic substrate and die, using a composite of conductive and non-conductive materials, allowing for effective scattering and attenuation of electromagnetic fields without the need for grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a Faraday cage is used to contain electromagnetic fields, then electromagnetic interference is reduced, but product size and manufacturing cost increase
Solution Approach 1:
The patent changes the electrical conductivity parameter of the shield layer to an intermediate range (10,000-100,000 S/m) that is neither highly conductive like traditional Faraday cages nor non-conductive. This parameter optimization allows effective EMI shielding through scattering and attenuation mechanisms while using much thinner layers, thus reducing product size without sacrificing shielding performance
Solution Approach 2:
The patent applies shielding material with specific local properties - a thin layer with controlled electrical conductivity positioned directly on or near the microelectronic die. This localized approach with tailored material properties achieves effective shielding without the need for extensive grounding structures or large-volume enclosures, thereby reducing overall product size
2Object-affected harmful factors
If magnetic absorber material is used to reduce electromagnetic field interference, then low frequency EMI is mitigated, but high frequency EMI remains unaddressed
Solution Approach 1:
The patent optimizes the electrical conductivity parameter to an intermediate range (10,000-100,000 S/m) that enables the shield layer to effectively scatter and attenuate electromagnetic fields across a broad frequency spectrum including high frequencies. This parameter optimization allows the same material layer to provide versatile shielding performance without being limited to specific frequency bands
Solution Approach 2:
The patent employs composite shielding materials that combine conductive and non-conductive components to achieve the target electrical conductivity range. This composite approach enables the material to exhibit both scattering and attenuation mechanisms simultaneously, providing broad frequency spectrum coverage from low to high frequencies, unlike single-material magnetic absorbers
3Object-affected harmful factors
If traditional EMI shielding methods are used, then electromagnetic field containment is achieved, but design complexity increases
Solution Approach 1:
The patent extracts the essential shielding function from complex traditional EMI containment structures and implements it through a simplified thin layer with controlled electrical conductivity. By removing unnecessary grounding structures, enclosures, and complex multi-layer configurations, the invention achieves effective EMI shielding with minimal design complexity while maintaining shielding performance
Solution Approach 2:
The patent simplifies shielding structure design by optimizing the electrical conductivity parameter to an intermediate range that enables effective shielding through inherent scattering and attenuation mechanisms. This parameter optimization eliminates the need for complex grounding schemes and multi-layer configurations, reducing design complexity while maintaining broad frequency spectrum coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents EMI across a wide frequency spectrum without increasing product size or cost, enhancing the reliability and performance of microelectronic packages by reducing electromagnetic field interference.
Implementation Method 1
an electromagnetic interference shield layer on at least one of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between 10,000 and 100,000 siemens per meter
Data Source
AI summary
A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.