EMI Shielding Layer Printing for Conformal Semiconductor Packages
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Solution Overview
Problem
Current methods for manufacturing electromagnetic interference shielding layers on semiconductor packages are inefficient, requiring heat, vacuum, and multiple steps, and often result in non-conformal and non-adherent shielding that is not adaptable to individual packages or complex designs, and are not cost-effective.
Innovation Solution
A method using an ink composition with metal precursors and organic compounds applied via inkjet technology, followed by irradiation to form a conformal electromagnetic interference shielding layer directly on the semiconductor package, which is adaptable and can be tailored for each package, avoiding expensive vacuum processes and heat exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods (vacuum deposition, electrochemical methods, conductive paste coating) are used to manufacture electromagnetic interference shielding layers, then a shielding layer can be produced, but the process requires expensive vacuum equipment, heat treatment, and multiple complex steps including masking and de-masking
Solution Approach 1:
The patent replaces complex mechanical and thermal manufacturing processes with a printing-based system. Instead of using vacuum deposition equipment, electrochemical cells, or high-temperature furnaces, the invention uses a printing head to directly deposit shielding material or precursor materials onto the semiconductor package surface, followed by simple thermal curing or sintering at reduced temperatures and times
Solution Approach 2:
The invention changes the processing parameters from high-temperature vacuum deposition or electrochemical conditions to lower-temperature printing and curing processes. The shielding layer is formed by printing metal precursors or conductive inks and then curing them at temperatures significantly lower than conventional methods, eliminating the need for expensive vacuum equipment and complex masking steps
2Reliability
If conventional shielding methods are used, then shielding coverage can be achieved, but the shielding layer is not conformal and does not adhere well to the semiconductor package surface
Solution Approach 1:
The printing system enables precise deposition of shielding material directly onto the semiconductor package surface, creating conformal coverage that follows the package contours. The printed layer adheres well to the surface without requiring complex adhesion promoters or multiple coating steps used in conventional methods
Solution Approach 2:
The printing process allows for localized deposition of shielding material only where needed on the semiconductor package. The system can vary the shielding layer properties (thickness, material composition, pattern) at different locations on the package surface, achieving optimal conformality and adhesion for each specific area
3Reliability
If conventional methods are used to produce electromagnetic interference shielding, then shielding can be achieved, but the process is time-consuming and requires multiple steps including masking, deposition, and de-masking
Solution Approach 1:
The printing system eliminates time-consuming masking and de-masking steps by directly printing the shielding pattern onto the semiconductor package. The shielding material is deposited only in the required areas through programmed printing paths, eliminating the need for physical masks and subsequent removal processes
Solution Approach 2:
The printing process enables continuous deposition of shielding material without interruption for masking changes or de-masking operations. The system can print complex shielding patterns in a single continuous operation, significantly reducing manufacturing cycle time compared to conventional step-by-step processes
4Reliability
If conventional shielding techniques are used, then electromagnetic interference protection can be provided, but the process requires expensive vacuum equipment and facilities
Solution Approach 1:
The printing system replaces expensive vacuum deposition equipment with affordable printing hardware. The shielding layer is formed by printing metal precursors or conductive inks that are then cured at low temperatures, eliminating the need for costly vacuum chambers, sputtering equipment, or electrochemical cells
Solution Approach 2:
The invention uses inexpensive printing materials such as conductive inks, metal nanoparticle suspensions, or precursor solutions that can be deposited from ambient atmosphere. These materials replace expensive vacuum-deposited metal films or electrochemically deposited layers, significantly reducing material and equipment costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid, cost-effective, and flexible production of thin, effective electromagnetic interference shielding layers that adhere well to semiconductor packages, even under mechanical stress, and can be applied before or after dicing, with improved adhesion and resistance to thermal and mechanical influences.
Implementation Method 1
applying at least a part of the ink composition onto the semiconductor package, preferably by using inkjet technology, wherein a precursor layer is formed
Implementation Method 2
treating the precursor layer with an irradiation, wherein at least 80%, for example at least 90%, of the irradiation has a wavelength in the range from 100 nm to 1 mm
Implementation Method 3
At least one organic compound, which is a liquid at room temperature and ambient pressure; which is preferably a volatile organic compound
Data Source
AI summary
A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.