Selective EMI Shielding Mask Layout for Semiconductor Packages
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Solution Overview
Problem
Existing methods for selective electromagnetic interference (EMI) shielding of semiconductor packages are challenging due to the technical difficulties in placing and removing masks, which can shift during processing and are hard to use with unconventionally shaped packages.
Innovation Solution
A method and device for selective EMI shielding using a mask, where the mask is applied and removed using a pick-and-place process, and the shielding layer is formed over the semiconductor package, allowing for the exposure of specific areas such as contact pads or antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is applied prior to forming the shielding layer to achieve selective EMI shielding, then the shielding can be applied to only a portion of the semiconductor package, but the mask is technically challenging to place and remove, susceptible to shifting during processing, and difficult to use with unconventionally shaped packages
Solution Approach 1:
The mask is divided into multiple segments or sections that can be independently positioned and applied to different areas of the semiconductor package. This segmentation allows the mask to adapt to unconventionally shaped packages and reduces the complexity of placing and removing a single large mask, while still achieving precise selective shielding coverage.
2Manufacturing precision
If a mask is used for selective EMI shielding, then portioned shielding is achieved, but the mask shifts during processing affecting precision
Solution Approach 1:
Alignment features such as tabs, slots, or registration marks are incorporated into the mask design before the actual shielding application. These preliminary structural elements ensure proper positioning of the mask relative to the semiconductor package, preventing shifts during processing and maintaining precise shielding coverage throughout the manufacturing process.
3Manufacturing precision
If traditional masking methods are used for selective EMI shielding, then portioned shielding is possible, but the process is complex and costly
Solution Approach 1:
The mask design incorporates universal features that allow it to be used across different semiconductor package types and shapes. By integrating alignment features, removable structures, and adaptable geometries into a single mask system, the solution reduces the need for multiple specialized masks and complex masking procedures, thereby simplifying the overall process while maintaining selective shielding capability.
Data Source
AI summary
A semiconductor device is made by providing a strip substrate including a plurality of units. A hole is formed in the strip substrate. An encapsulant is deposited over the strip substrate. A mask is disposed over the strip substrate and encapsulant with a leg of the mask disposed in the hole. A shielding layer is formed over the mask and strip substrate. The mask is removed after forming the shielding layer. The strip substrate is singulated to separate the plurality of units from each other after forming the shielding layer.