Electronic Element Module Shielding Against EMI
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Solution Overview
Problem
There is a need for electronic element modules that can effectively miniaturize and shield radio frequency electronic components from electromagnetic interference (EMI) while protecting them from external environments, which existing technologies have not adequately addressed.
Innovation Solution
The electronic element module incorporates a substrate with ground wirings, a sealing portion, and a shielding portion, including shielding walls and a shielding layer, connected to the ground wirings and connection conductors, to provide comprehensive protection and shielding against electromagnetic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic elements are miniaturized to reduce size and weight, then portability is improved, but shielding effectiveness against electromagnetic interference deteriorates
Solution Approach 1:
The patent implements nested shielding structures where shielding walls are disposed within the sealing portion, and multiple grounding layers are stacked at different levels. The first grounding layer is disposed at a first level, the second grounding layer at a second level, creating a nested configuration that maximizes shielding effectiveness within the miniaturized module volume.
Solution Approach 2:
The patent utilizes vertical stacking of grounding layers at different levels (first level and second level) to create three-dimensional shielding architecture. This multi-level grounding structure provides enhanced electromagnetic interference shielding without increasing the horizontal footprint, enabling effective shielding in the miniaturized vertical space.
2Object-affected harmful factors
If shielding structures are added to protect against electromagnetic interference, then shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the sealing portion simultaneously provides environmental protection and houses the shielding walls; the connection conductors perform both electrical connection and structural support; the grounding layers are integrated with the substrate structure. This merging reduces the number of separate components and simplifies the overall device complexity.
Solution Approach 2:
The shielding walls serve multiple functions: they provide electromagnetic shielding, structural support for the sealing portion, and pathways for connection conductors. The grounding layers simultaneously provide EMI shielding, electrical grounding, and structural integration with the substrate. This multi-functionality reduces the need for separate dedicated components.
3Object-affected harmful factors
If multiple grounding layers are stacked to enhance shielding, then shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates grounding layers during the substrate fabrication process itself, rather than adding them as separate post-processing steps. The first and second grounding layers are formed as part of the multi-layer substrate structure, utilizing existing fabrication processes for creating layered substrates, which simplifies the overall manufacturing流程.
Solution Approach 2:
The patent utilizes variations in the physical and electrical parameters of the grounding layers (such as conductivity, thickness, and spatial arrangement at different levels) to optimize shielding effectiveness. By adjusting these parameters during standard fabrication processes, the patent achieves enhanced shielding without requiring complex additional manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields electronic elements from external electromagnetic interference and protects them from environmental impacts, enhancing the reliability of the module's performance and reducing manufacturing defects.
Implementation Method 1
a shielding portion disposed along the sealing portion, and connected to the connection conductors... effectively shields electronic elements from external electromagnetic interference
Data Source
AI summary
An electronic element module includes: a substrate including ground wirings; at least one electronic element mounted on a first surface of the substrate; a sealing portion embedding the at least one electronic element therein and disposed on the substrate; connection conductors partially disposed on side surfaces of the substrate and having lower ends connected to the ground wirings; and a shielding portion disposed along the sealing portion, and connected to the connection conductors.