EMI Shielding Package With Low-Melting Alloy Bond
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Solution Overview
Problem
Existing EMI shielding packages for RF components are prone to erosion of exposed components, suffer from high manufacturing complexity and costs due to the use of solder and protective colloids, and have inefficiencies in shielding effectiveness.
Innovation Solution
An EMI shielding package comprising a substrate with electronic components, a metal cap with peripheral walls attached via pads, and a potting compound that seals and encapsulates the components, using a bonding agent with a lower melting point than solder to prevent damage and enhance shielding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder is used as a bonding agent to attach the metal cap to the substrate, then the metal cap can be securely fixed, but the solder may melt at very high operating temperatures and negatively impact the electronic components
Solution Approach 1:
The patent replaces traditional solder with a low-melting-point alloy bonding agent that acts as a sacrificial element. This bonding agent is designed to melt at controlled temperatures below the operating temperature of electronic components, thereby protecting them from thermal damage while maintaining secure attachment of the metal cap during normal operation.
Solution Approach 2:
The invention changes the melting point parameter of the bonding agent by using a low-melting-point alloy instead of conventional solder. This parameter change enables the bonding agent to melt at temperatures that protect electronic components from thermal stress, thus resolving the contradiction between bonding strength and component reliability.
2Reliability
If a colloid is used to cover and protect the chip and gold wires, then they are protected from damage, but the manufacturing process becomes complex and time consuming
Solution Approach 1:
The patent merges the protective function previously performed by the colloid with the metal cap structure itself. The metal cap is designed to directly cover and protect the chip and gold wires without requiring an additional colloid layer, thereby simplifying the manufacturing process while maintaining component protection.
Solution Approach 2:
The invention extracts and eliminates the colloid layer from the manufacturing process. By removing this intermediate protective layer and relying solely on the metal cap for protection, the manufacturing process becomes less complex and time-consuming while achieving the same protective function.
3Object-affected harmful factors
If the metal cap shields only the electronic component 11b and the chip 12, then EMI shielding is provided for these components, but the exposed electronic component 11a is easily eroded
Solution Approach 1:
The patent designs the metal cap to serve multiple functions simultaneously: it provides EMI shielding for sensitive components while also acting as a protective enclosure for all electronic components on the substrate. This universal design ensures that both shielded and exposed components are protected from environmental erosion, resolving the contradiction between selective EMI shielding and overall component durability.
Data Source
AI summary
An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.