EMI Shielding Package Layout That Avoids Substrate Pad Shorting
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Solution Overview
Problem
Conventional semiconductor packages face issues with electromagnetic interference (EMI) shielding, where the metal layer used for shielding easily overflows and contacts conductive pads on the substrate, leading to short circuits during the sputtering process.
Innovation Solution
A semiconductor package design featuring a shielding layer that extends from the encapsulant layer's edge to the substrate's lateral side, avoiding contact with conductive pads, and includes through holes to prevent overflow, combined with a grounding structure for electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal layer is formed on the encapsulant layer by sputtering to provide EMI shielding, then the shielding function is improved, but the metal layer easily overflows and contacts conductive pads, causing short circuits
Solution Approach 1:
An insulating layer is introduced as an intermediary between the metal shielding layer and the conductive pads on the substrate. This insulating layer prevents direct contact between the metal layer and conductive pads, eliminating the short circuit risk while preserving the EMI shielding function of the metal layer.
Solution Approach 2:
The insulating layer is formed on the substrate before the metal shielding layer is deposited. This preliminary action ensures that when the metal layer is formed by sputtering, the insulating layer is already in place to prevent overflow contact with conductive pads, proactively avoiding the short circuit problem.
2Object-affected harmful factors
If the metal layer is extended to the lateral side of the substrate to improve shielding coverage, then the EMI protection is enhanced, but the risk of contact with conductive pads increases
Solution Approach 1:
The insulating layer serves as a mediator that allows the metal shielding layer to extend to the lateral side of the substrate for improved coverage, while simultaneously preventing contact with conductive pads. The insulating layer bridges the gap between the need for extended shielding and the need to avoid short circuits.
3Object-affected harmful factors
If the metal layer is formed to cover the entire upper surface and side surface of the encapsulant layer, then the shielding effectiveness is improved, but the manufacturing precision required to avoid short circuits increases
Solution Approach 1:
The insulating layer acts as a buffer that reduces the precision requirements for metal layer formation. Since the insulating layer prevents short circuits, the metal layer can be formed with less stringent precision control, extending more freely to improve shielding effectiveness without the same risk of causing defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents short circuits while providing effective EMI shielding, enhancing electrical performance by protecting electronic components from external interference.
Implementation Method 1
a metal layer 15 is formed on an upper surface 13a and a side surface 13c of the encapsulant layer 13 and a side surface 10c of the substrate 10 by sputtering
Data Source
AI summary
An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.