EMI Shielding Layer Layout With Partition Wall to Contain Ink Overflow
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Solution Overview
Problem
The formation of an electromagnetic wave shielding layer using a liquid process can result in ink overflow, leading to defects such as short circuits between the shielding layer and conductive components outside the designated region.
Innovation Solution
An electronic device with an insulating partition wall along the outer edge of the ground electrode is used to contain the electromagnetic wave shielding layer ink, preventing overflow and subsequent defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a liquid process is used to form the electromagnetic wave shielding layer, then the manufacturing process is simplified and productivity is improved, but ink overflow occurs causing short circuit defects
Solution Approach 1:
An insulating partition wall is introduced as an intermediary structure between the ink application area and the surrounding conductive components. This partition wall contains the liquid ink within the designated region during the liquid process, preventing overflow that would cause short circuit defects while allowing the simplified liquid process to continue
Solution Approach 2:
The insulating partition wall is formed in advance before the electromagnetic wave shielding layer ink is applied. This preliminary action creates a containment structure that prevents future ink overflow issues, allowing the liquid process to proceed with high productivity without risking short circuit defects
2Device complexity
If the electromagnetic wave shielding layer is formed using a liquid process, then manufacturing complexity is reduced, but manufacturing precision deteriorates due to ink overflow
Solution Approach 1:
The insulating partition wall serves as a mediator that enables the use of a simple liquid process while maintaining high manufacturing precision. By containing the ink within the designated region, the partition wall ensures accurate placement of the electromagnetic wave shielding layer without the complexity of more precise application methods
Solution Approach 2:
The insulating partition wall provides localized containment exactly where needed - along the outer edge of the ground electrode. This local quality approach maintains precision at the critical interface between the shielding layer and conductive components, while allowing the rest of the process to remain simple
Data Source
AI summary
Provided are an electronic device including: a wiring board having a mounting surface; a plurality of electronic components mounted on the mounting surface; a ground electrode that surrounds at least one electronic component among the plurality of electronic components; an insulating protective layer that covers the at least one electronic component; an electromagnetic wave shielding layer that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer; and an insulating partition wall that is provided along an outer edge of the ground electrode, and a manufacturing method thereof.