EMI Shielding Device With Conductive Paste For PCB Mounting
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Solution Overview
Problem
Conventional electromagnetic-interference (EMI) shielding devices for printed circuit boards (PCBs) are costly due to the need for multiple molds and clamping elements, which also lead to ineffective shielding and instability during use, as electromagnetic radiation can leak through narrow gaps and the devices may not be firmly mounted.
Innovation Solution
An EMI shielding device comprising a first substrate with a shielding layer, through holes, and multiple second substrates connected via conductive paste, allowing for direct surface mounting on PCBs using surface mount technology (SMT) without molding or clamping, ensuring firm attachment and complete shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional molding method with multiple molds is used to manufacture different kinds of shielding devices, then shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent employs a universal mold that can manufacture multiple kinds of shielding devices with different shapes and configurations. The mold includes a movable clamping mechanism that can be adjusted to produce various shielding device geometries, eliminating the need for separate dedicated molds for each shielding device type. This universal approach maintains shielding effectiveness while significantly reducing mold development costs and manufacturing complexity.
2Stability of the object's composition
If clamping elements are mounted on PCB to secure shielding device, then shielding device is firmly mounted, but manufacturing cost of PCB increases
Solution Approach 1:
The patent integrates the mounting function directly into the shielding device structure by forming protrusions on the shielding device that fit into corresponding recesses on the PCB surface. This merging of the shielding function with the mounting function eliminates the need for separate clamping elements, reducing PCB manufacturing cost while maintaining firm mounting stability.
3Ease of operation
If shielding device is clamped by clamping elements on PCB, then shielding device can be mounted on PCB, but narrow gaps are formed causing electromagnetic radiation leakage
Solution Approach 1:
The patent incorporates a flexible sealing layer that conformally covers the shielding device surface and extends into the recesses on the PCB. This flexible film fills and seals the narrow gaps between the shielding device and PCB surface, preventing electromagnetic radiation leakage while maintaining the mounting capability provided by the protrusion-recess structure.
4Adaptability or versatility
If multiple molds are developed for different shielding devices, then various shielding device shapes can be produced, but device complexity increases
Solution Approach 1:
The patent designs a universal mold system with adjustable and reconfigurable components that can produce multiple shielding device shapes and configurations. The mold includes movable clamping elements and adjustable positioning mechanisms that can be reconfigured for different shielding device geometries, reducing the total number of molds required and simplifying the overall manufacturing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, enhances shielding effectiveness by eliminating gaps, and ensures stable mounting of the EMI shielding device on PCBs, effectively preventing electromagnetic interference.
Implementation Method 1
The conductive paste is mounted between the first substrate and the at least one second substrate, and covering the first shielding layer of the first substrate and the second shielding layer of the at least one second substrate to electrically connect the first shielding layer and the second shielding layer
Data Source
AI summary
An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.