EMI Shielding Device With PTCR Core Layer
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Solution Overview
Problem
Electronic devices require effective electromagnetic interference (EMI) shielding to achieve high integration, high assembly density, and low production cost, especially in small devices with high transmission speeds, where traditional methods fail to provide adequate noise suppression across both in-phase and reverse current scenarios.
Innovation Solution
An EMI shielding device comprising a ferrite material outer layer with a positive temperature coefficient resistor (PTCR) core layer sandwiched between electrodes, which extends to the ends of the ferrite material, enhancing magnetic field shielding and current protection by adjusting impedance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional EMI shielding devices are used, then EMI noise can be suppressed, but the device size increases and assembly density decreases
Solution Approach 1:
The patent combines multiple functional layers (ferrite material outer layer for EMI shielding, PTCR core layer for current protection, and electrode layers for electrical connection) into a single integrated device structure. This merging of functions allows the device to provide both EMI noise suppression and current protection without requiring separate components, thereby reducing overall device volume and increasing assembly density.
Solution Approach 2:
The EMI shielding device is designed to perform multiple functions simultaneously: it provides EMI shielding through the ferrite material outer layer, current protection through the PTCR core layer, and electrical connection through the electrode layers. This multi-functionality eliminates the need for separate EMI shielding devices and current protection devices, reducing the total volume required and increasing assembly density.
2Productivity
If high integration and high assembly density are achieved, then production cost decreases, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The device employs composite material structures, including a ferrite material outer layer combined with a PTCR core layer and electrode layers. This composite structure maintains effective EMI shielding performance while enabling high integration and assembly density. The ferrite material provides magnetic properties for EMI suppression, while the PTCR material adds current protection functionality, creating a multi-functional composite that delivers both EMI effectiveness and space efficiency.
Solution Approach 2:
The device structure nests multiple functional layers within each other: the PTCR core layer is positioned inside the ferrite material outer layer, with electrode layers integrated between and around these core components. This nested arrangement maximizes functional density within a compact volume, achieving high assembly density without compromising EMI shielding effectiveness.
3Device complexity
If single-function EMI shielding devices are used, then device complexity is low, but current protection capability is lost
Solution Approach 1:
The patent merges EMI shielding functionality and current protection functionality into a single device structure. The ferrite material outer layer provides EMI shielding, while the PTCR core layer provides current protection. By combining these functions in one device rather than using separate components, the overall system complexity is reduced while simultaneously gaining current protection capability that would otherwise require additional devices.
Solution Approach 2:
The EMI shielding device is designed as a universal component that performs both EMI shielding and current protection functions. The multi-functional design eliminates the need for separate current protection devices, simplifying the overall system structure while enhancing reliability through integrated current protection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively filters high-frequency noise and protects against currents, offering concurrent EMI shielding and self-recovery current protection, achieving performance beyond traditional single-function devices while maintaining a low-cost, thin form factor.
Implementation Method 1
In case of in-phase current (i.e. common mode current), due to overlapping magnetic fluxes, impedance will be generated for eliminating noise.
Implementation Method 2
A sandwich structure is provided, wherein the sandwich structure includes a first electrode, a second electrode, and a PTCR core layer sandwiched between the first and the second electrodes.
Data Source
AI summary
An electromagnetic interference (EMI) shielding device and manufacturing method thereof are provided. The EMI shielding device includes at least one ferrite material outer layer, a first and a second electrodes within the ferrite material outer layer, and a positive temperature coefficient resistor (PTCR) core layer sandwiched between the first and the second electrodes in the ferrite material outer layer. The first and the second electrodes extend to two ends of the ferrite material outer layer respectively.