Embedded EMI Shielding via Segmented Insulating Cavity
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Solution Overview
Problem
High-frequency integrated circuit (IC) chips are susceptible to electro-magnetic interference (EMI), which can disrupt the performance and stability of electronic devices, and existing shielding methods are inadequate in preventing external EMI from affecting the IC chips.
Innovation Solution
A cover structure is manufactured using a method involving a first and second insulating layer with a cavity, where a metal layer is formed on the cavity and patterned to create a patterned circuit layer, which acts as an electro-magnetic wave shielding layer when positioned on a circuit board, effectively reducing external EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal cover is mounted above the circuit board to prevent EMI, then EMI shielding effectiveness is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The shield structure is divided into multiple segments: a first insulating layer with a first cavity, a second insulating layer with a second cavity, and a conductive layer filling both cavities. This segmentation allows the shield to be integrated within the circuit board structure rather than requiring a separate external cover, thereby reducing overall device complexity while maintaining EMI shielding effectiveness.
Solution Approach 2:
The conductive layer is nested within the cavities formed by the insulating layers, creating a nested structure where the shielding function is embedded inside the board structure. This nesting approach eliminates the need for external metal covers and simplifies the overall device architecture while preserving EMI protection.
2Reliability
If a metal cover is mounted above the circuit board to prevent EMI, then EMI shielding effectiveness is improved, but ease of manufacture deteriorates
Solution Approach 1:
The shield structure is divided into multiple segments: a first insulating layer with a first cavity, a second insulating layer with a second cavity, and a conductive layer filling both cavities. This segmentation allows the shield to be integrated within the circuit board structure rather than requiring a separate external cover, thereby reducing overall device complexity while maintaining EMI shielding effectiveness.
Solution Approach 2:
The EMI shielding function is merged with the existing circuit board structure by forming insulating layers and cavities during the board manufacturing process itself. The conductive layer is deposited within these cavities, combining the shielding function with the board fabrication steps and eliminating the need for separate shielding component assembly.
3Reliability
If the second insulating layer thickness is increased to improve shielding, then EMI shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
Instead of requiring uniform thickness throughout the entire insulating layer, the design uses localized cavities with specific depth requirements. The first cavity has a first depth and the second cavity has a second depth, allowing different regions to have different thickness characteristics. This local quality approach reduces overall manufacturing precision requirements while maintaining effective shielding at critical locations.
Data Source
AI summary
A method of manufacturing a cover structure is provided. A first insulating layer is provided. The first insulating layer has a first surface and a second surface opposite to each other. A second insulating layer is provided. The second insulating layer has a third surface and a fourth surface opposite to each other and an opening passing through the third surface and the fourth surface. A thickness of the second insulating layer is greater than a thickness of the first insulating layer. The first insulating layer and the second insulating layer are laminated to each other, so that the third surface of the second insulating layer connects to the second surface of the first insulating layer. A cavity is defined by the opening of the second insulating layer and the first insulating layer. A metal layer is formed on the cavity.