Semiconductor Package EMI Shielding via Segmented Conductive Walls
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Solution Overview
Problem
Semiconductor packages face challenges in effectively shielding against electromagnetic interference (EMI), which can affect the operation of integrated circuits and potentially harm human health, and existing solutions do not adequately address the need for reliable EMI shielding in wearable and mobile electronic devices.
Innovation Solution
A semiconductor package design incorporating conductive walls and pillars surrounding a semiconductor device, with a conductive roof and dielectric layers to create an EMI shielding structure that isolates the components and prevents material migration or contamination, while also providing a reliable ground path for the conductive roof.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI shielding structures are used, then electromagnetic waves can be blocked to some extent, but the shielding effectiveness is insufficient and material migration or contamination can still occur
Solution Approach 1:
The EMI shielding structure is divided into multiple segmented conductive walls arranged in a grid pattern, creating multiple small enclosed regions rather than one large open space. This segmentation increases the number of barriers that electromagnetic waves must penetrate, significantly improving shielding effectiveness while also preventing material migration within each small enclosed region
Solution Approach 2:
The conductive walls are embedded within the dielectric layer, creating a nested structure where the conductive elements are contained within the insulating material. This nesting prevents material migration of the conductive walls while maintaining their EMI shielding function, as the dielectric layer acts as a containment barrier
2Object-affected harmful factors
If conductive walls are added to improve EMI shielding, then electromagnetic wave blocking is enhanced, but the device complexity increases
Solution Approach 1:
The conductive walls serve multiple functions simultaneously: they block electromagnetic waves, provide grounding paths, and prevent material migration when embedded in the dielectric layer. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity despite the added shielding capability
Solution Approach 2:
The EMI shielding function is merged with the grounding system by connecting the conductive walls to ground terminals. This combination achieves both electromagnetic wave blocking and electrical grounding using the same structural elements, reducing overall device complexity compared to having separate shielding and grounding systems
3Reliability
If conductive pillars are used to provide ground paths, then electrical connectivity is improved, but the risk of material migration and contamination increases
Solution Approach 1:
The conductive pillars are embedded within the dielectric layer, creating a nested configuration where the conductive element is contained within the insulating material. This nesting provides reliable electrical connectivity through the pillar while the dielectric layer prevents material migration and contamination between the pillar and surrounding components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields semiconductor packages from EMI, prevents material degradation, and ensures reliable electrical connectivity, enhancing the performance and safety of wearable and mobile electronic devices.
Implementation Method 1
a conductive roof 1430 and a plurality of conductive walls 1310. The conductive roof 1430 and the conductive walls 1310 may enclose the semiconductor device 1200
Implementation Method 2
Conductive pillars may be disposed on the package substrate and bonded to the conductive roof
Implementation Method 3
A first dielectric layer may fill a space between the package substrate and the conductive roof
Data Source
AI summary
A semiconductor package may include a semiconductor device mounted on a package substrate, a conductive roof located over the semiconductor device, a plurality of conductive walls disposed on the package substrate and arrayed in a closed loop line surrounding the semiconductor device. Conductive pillars may be disposed in regions between the conductive walls on the package substrate and bonded to the conductive roof. The semiconductor package may include a first dielectric layer filling a space between the package substrate and the conductive roof.