EMI Shielding Structure With Alternating Sputtering And Plating Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing EMI shielding structures face inefficiencies due to uneven thickness caused by sputtering manufacturing methods, leading to suboptimal performance and increased costs.
Innovation Solution
The EMI shielding structure employs a multi-layered approach with alternating sputtering and chemical electroless plating processes to achieve uniform thickness, comprising a substrate, chip units, packing layers, and three shielding layers to enhance electromagnetic interference shielding efficiency and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sputtering manufacturing method is used, then EMI shielding structure can be formed, but the thickness becomes uneven
Solution Approach 1:
The shielding structure is divided into multiple layers (first shielding layer, second shielding layer, third shielding layer) with different materials and functions. Each layer addresses specific shielding requirements, allowing optimization of thickness distribution across different regions to achieve overall uniformity while maintaining effectiveness.
Solution Approach 2:
The patent employs composite material structure combining different shielding materials in multiple layers. The first shielding layer uses one material composition, while the second and third layers use different materials, creating a composite structure that compensates for thickness non-uniformity through material property differences and achieves both uniformity and shielding reliability.
2Productivity
If sputtering manufacturing method is used, then EMI shielding structure can be formed, but manufacturing time is prolonged
Solution Approach 1:
The patent applies preliminary action by forming the packing layer completely before applying any shielding layers. This sequencing allows subsequent shielding layers to be applied uniformly over a stable base structure, reducing rework and adjustment time while maintaining manufacturing efficiency.
Solution Approach 2:
The manufacturing process uses periodic action through alternating sputtering and electroplating steps for forming the three shielding layers. This periodic alternation of different deposition methods optimizes both speed and quality, achieving uniform thickness faster than continuous use of a single method.
3Reliability
If sputtering manufacturing method is used, then EMI shielding structure can be formed, but manufacturing cost is increased
Solution Approach 1:
The patent applies parameter changes by varying the material composition and thickness parameters of different shielding layers. The first shielding layer has different material parameters than the second and third layers, allowing optimization of shielding efficiency while controlling material costs through selective use of expensive and economical materials in different regions.
Solution Approach 2:
By using composite materials with different cost characteristics in different layers, the patent achieves cost optimization. The multi-layer composite structure allows substitution of expensive materials with more economical alternatives in certain layers while maintaining overall shielding effectiveness, thereby reducing total manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures more uniform thickness across the EMI shielding structure, significantly improving shielding efficiency while lowering production costs by addressing the uneven thickness issues inherent in traditional sputtering methods.
Implementation Method 1
utilizes alternating sputtering manufacturing process and chemical electroless plating manufacturing process
Implementation Method 2
utilizes alternating sputtering manufacturing process and chemical electroless plating manufacturing process
Data Source
AI summary
An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost.