Semiconductor Package EMI Shielding via Substrate Grounding
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Solution Overview
Problem
Semiconductor device packages face challenges with electromagnetic interference (EMI) due to high clock speeds and smaller sizes, leading to increased electromagnetic emissions, which can affect neighboring devices, and existing shielding solutions like conductive casings are prone to peeling and require precise matching, increasing manufacturing costs and time.
Innovation Solution
A semiconductor device package design featuring a substrate unit with grounding elements and a recessed package body, where an EMI shield is electrically connected to the grounding elements, providing a pathway to ground electromagnetic emissions without the need for adhesives, allowing for flexible application across different sizes and shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive casing is used to shield semiconductor devices, then electromagnetic interference is reduced, but the casing is prone to peeling or falling off due to adhesive degradation from temperature and humidity
Solution Approach 1:
The patent replaces the mechanical adhesive bonding system with an integrated electrical connection system. The EMI shield is electrically connected to the substrate through conductive structures that are formed as part of the substrate assembly process, eliminating the need for separate adhesive bonding operations and the reliability issues associated with adhesive degradation from temperature and humidity.
Solution Approach 2:
The patent merges the EMI shielding function with the substrate structure itself. The EMI shield is integrated with the substrate through conductive traces and contact structures that are formed during substrate manufacturing, combining the mechanical support function of the substrate with the EMI protection function in a single unified structure.
2Object-affected harmful factors
If an electrically conductive casing is secured to the package, then EMI is reduced, but the size and shape matching requirements increase manufacturing cost and time
Solution Approach 1:
The patent creates a universal EMI shielding solution that can be applied to various package sizes and shapes. The EMI shield is designed as a separate component that can be adapted to different substrate configurations, and the electrical connection method through conductive traces allows the same basic shielding structure to be used across multiple package types without requiring custom-matched casings for each package size.
Solution Approach 2:
The patent segments the EMI shielding function from the package casing as a separate EMI shield component rather than requiring the main package casing to serve both structural and EMI shielding functions. This allows the EMI shield to be optimized for electromagnetic protection while the substrate and package body can be optimized for mechanical and electrical performance.
3Object-affected harmful factors
If different casings are required for different package sizes and shapes, then EMI shielding is effective, but manufacturing cost and time increase
Solution Approach 1:
The patent implements a universal EMI shield design that can be used across different package types. The conductive connection structures are integrated into the substrate manufacturing process, allowing the same EMI shielding approach to be applied to various package sizes and shapes without requiring separate casing designs for each package type, thereby maintaining productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI by grounding electromagnetic emissions, enhances reliability by avoiding adhesive issues, and simplifies manufacturing by accommodating various package sizes and shapes without precise matching, thereby reducing costs and time.
Implementation Method 1
The grounding element includes a connection surface disposed adjacent to the upper surface of the substrate unit... the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield
Data Source
AI summary
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit; (2) a semiconductor device disposed adjacent to the upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body. A periphery of the package body is laterally recessed, such that a connection surface of the grounding element is electrically exposed and electrically connected to the EMI shield. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.