Internal EMI Shielding in Semiconductor Substrates
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Solution Overview
Problem
The increasing size and EMI issues in electronic devices due to the need for EMI shielding in semiconductor devices, which can hinder miniaturization and lead to interference between shared shielding structures.
Innovation Solution
A semiconductor device substrate with alternating wiring and insulating layers, featuring primary and dummy conductive vias that create an electromagnetic shielding structure, allowing for reduced device size and effective EMI protection without increasing device height or width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an EMI shielding can is installed around the semiconductor device, then EMI protection is improved, but the device size (height and width) increases
Solution Approach 1:
The EMI shielding structure is nested within the substrate itself by integrating dummy conductive vias and wiring patterns into the existing multi-layer substrate structure. This internal shielding approach eliminates the need for external shielding cans, thereby protecting against EMI without increasing device dimensions.
Solution Approach 2:
The shielding function is transitioned from a three-dimensional external structure (shielding can) to a two-dimensional planar structure embedded within the substrate layers. The dummy conductive vias and wiring patterns form a planar shielding network that provides EMI protection without adding vertical height.
2Productivity
If multiple semiconductor devices share one EMI shielding can, then space utilization is improved, but EMI interference occurs between package modules
Solution Approach 1:
Each semiconductor device package module is equipped with its own dedicated EMI shielding structure formed by dummy conductive vias and wiring patterns within its substrate. This segmentation of shielding functions into individual modules prevents EMI cross-talk between adjacent devices while maintaining efficient space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate effectively shields EMI emissions laterally, downward, and upward, enabling the miniaturization of electronic devices while preventing interference between shared shielding structures.
Implementation Method 1
the dummy conductive vias and the second ones of the wiring patterns electrically connected thereto have a same electric potential to define an electromagnetic shielding structure within the substrate
Data Source
AI summary
A semiconductor device includes a substrate comprising a stack of alternating wiring layers and insulating layers. The wiring layers include conductive wiring patterns. Primary conductive vias extend through respective ones of the insulating layers and electrically connect first ones of the wiring patterns on different ones of the wiring layers to provide electrical connections between opposing first and second surfaces of the substrate. Dummy conductive vias extend through respective ones of the insulating layers and electrically connect second ones of the wiring patterns on different ones of the wiring layers. The dummy conductive vias are arranged in the substrate around a perimeter of a region including the first ones of the wiring patterns, and the dummy conductive vias and the second ones of the wiring patterns electrically connected thereto have a same electric potential to define an electromagnetic shielding structure within the substrate.