EMI Shielding Film Formation with Tapered Support Openings
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Solution Overview
Problem
Existing methods for forming electromagnetic interference (EMI) shielding films for semiconductor packages often result in poor yield due to issues such as burrs and cracks in the shielding material layer, leading to potential short circuits and exterior defects.
Innovation Solution
The proposed apparatus and method involve an adhesive member with pocket regions for accommodating chip structure bumps, a support member with aligned openings, a coating member for forming a shielding material layer, and a pickup member to detach the chip structure covered by the shielding material layer. The support member's design, including inclined side surfaces, facilitates the bending and separation of the shielding material layer to prevent burrs and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to form EMI shielding films, then the shielding material layer can be formed on the chip structure, but burrs and cracks occur in the shielding material layer leading to poor yield
Solution Approach 1:
The support member is prepared in advance with a specifically designed opening structure (wider upper region than lower region) before the shielding material layer is formed. This preliminary preparation of the support member geometry enables the shielding material layer to be formed without burrs and cracks, as the opening structure provides adequate space for material deposition and prevents defects during the coating process.
Solution Approach 2:
The support member acts as an intermediary between the coating process and the final EMI shielding film. Its specially designed opening structure mediates the formation of the shielding material layer, preventing direct contact between the coating applicator and the chip structure, thereby eliminating the causes of burrs and cracks while still allowing the shielding material to be deposited uniformly.
2Object-affected harmful factors
If the shielding material layer is formed directly on the chip structure, then EMI shielding is achieved, but burrs and cracks cause short circuits and exterior defects
Solution Approach 1:
The support member's opening is segmented into two distinct regions: a lower region with a first width and an upper region with a second width that is greater than the first width. This segmentation allows the shielding material layer to be formed in the wider upper region without constriction, preventing burrs and cracks while maintaining EMI shielding effectiveness. The segmented structure provides adequate material flow paths during deposition.
Solution Approach 2:
Different regions of the support member opening are given different dimensional characteristics to suit local requirements. The lower region has a narrower width to provide structural support and proper positioning, while the upper region has a wider width to accommodate the shielding material layer formation without defects. This local differentiation of geometric properties ensures both structural integrity and surface quality.
3Ease of manufacture
If conventional formation methods are used, then the process is simple, but the yield is poor due to burrs and cracks
Solution Approach 1:
The geometric parameters of the support member opening are changed from a conventional uniform structure to a tapered structure with a wider upper region. This parameter change in the support member geometry enables defect-free formation of the shielding material layer without complicating the overall manufacturing process. The modified opening dimensions allow the existing coating equipment to operate more effectively, improving yield while maintaining process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the yield of EMI shielding film formation by preventing burrs and cracks in the shielding material layer, thereby reducing the risk of short circuits and exterior defects, and ensuring a more reliable EMI shielding for semiconductor packages.
Implementation Method 1
adsorbing, by a pickup member at a first level, at least one chip structure, among the chip structures covered by the shielding material layer
Data Source
AI summary
An apparatus for forming an electromagnetic interference (EMI) shielding film, includes an adhesive member having a pocket region, a support member disposed on or below the adhesive member, the support member having an opening at a position aligned with the pocket region, a coating member configured to form a shielding material layer on the adhesive member and the chip structure disposed on the adhesive member, and a pickup member configured to detach, from the adhesive member, the chip structure covered by the shielding material layer. The support member has a first side surface defining a lower region of the opening, and a second side surface spaced apart from the first side surface in a first direction, the second surface defining an upper region of the opening. A width of the lower region in the first direction is less than a width of the upper region in the first direction.