Thin-Film EMI Shielding and Thermal Pad Assembly
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Solution Overview
Problem
Miniaturized electronic devices face challenges with electromagnetic interference (EMI) shielding and thermal management due to the generation of electromagnetic waves and heat, which can lead to malfunctions and reduced durability, especially in compact designs where conventional EMI shielding structures and thermal pads are inadequate.
Innovation Solution
An electronic circuit board assembly incorporating an EMI shielding structure, such as an EMI shielding tape, and a highly compressible thermal pad with a polymer matrix and ceramic fillers like aluminum oxide or aluminum nitride, which ensures effective heat dissipation and electrical insulation, allowing for a very thin design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional EMI shielding structure is installed to block electromagnetic waves, then EMI protection is improved, but the device thickness and complexity increase
Solution Approach 1:
The patent applies a thin-film EMI shielding structure formed by sputtering conductive materials (such as ITO or IZO) directly onto the circuit board surface. This thin film approach provides effective EMI shielding while maintaining a minimal thickness profile, avoiding the need for bulky conventional shielding enclosures or foils.
Solution Approach 2:
The EMI shielding function is merged with the circuit board structure itself by forming the shielding layer integrally with the board through deposition processes. Additionally, the shielding structure is combined with the thermal pad assembly, where the conductive shielding layer serves both EMI protection and thermal conduction purposes, eliminating the need for separate shielding components.
2Volume of moving object
If multiple electronic circuit devices are integrated in a small space for miniaturization, then device compactness is improved, but heat generation and EMI susceptibility increase
Solution Approach 1:
The patent introduces a thermal pad as an intermediary component between the electronic circuit devices and the EMI shielding structure. This thermal pad serves dual functions: it provides a thermal conduction path to dissipate heat from the circuits, and it maintains electrical insulation between the conductive shielding layer and the circuit devices, enabling compact integration without compromising thermal management.
Solution Approach 2:
The thermal pad utilizes composite material structure with ceramic fillers (such as aluminum oxide or aluminum nitride) embedded in a polymer matrix. This composite formulation provides high thermal conductivity for effective heat dissipation while maintaining electrical insulation properties, allowing multiple circuits to be densely packed without overheating.
3Use of energy by moving object
If a thermal pad is used for passive cooling without power consumption, then energy efficiency is improved, but thermal contact and adhesion reliability become critical challenges
Solution Approach 1:
The thermal pad is merged with the EMI shielding structure assembly, where the pad is positioned between the circuit devices and the shielding layer. This integration ensures that the thermal pad maintains reliable contact with both surfaces through the compression and adhesion of the assembly, while the conductive shielding layer above provides additional pressure to ensure thermal contact without requiring additional fastening mechanisms.
4Temperature
If the thermal pad ensures close contact with electronic circuits for heat transfer, then thermal dissipation is improved, but electrical insulation between the thermal pad and circuits must be maintained
Solution Approach 1:
The thermal pad employs composite materials with ceramic particles (aluminum oxide, aluminum nitride) dispersed in an electrically insulating polymer matrix. This composite structure provides high thermal conductivity through the ceramic fillers while the polymer binder maintains electrical insulation, enabling the pad to achieve both effective thermal contact and electrical isolation simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient EMI shielding and thermal management at a low cost, enabling the manufacture of thin electronic circuit board assemblies with improved durability and reduced risk of malfunctions, suitable for compact devices like smartphones and tablets.
Implementation Method 1
a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices... transfer the heat generated from the plurality of electronic circuit devices to the EMI shielding structure
Implementation Method 2
an EMI shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices... block the electromagnetic wave
Data Source
AI summary
Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.