Electronic Module EMI Shielding via Trench Conductive Layers
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Solution Overview
Problem
Electronic modules face operational interference due to electro-magnetic interference (EMI) from high-frequency and RF components, which affects the normal functioning of these components.
Innovation Solution
An electronic module design incorporating a circuit board with grounding pads, molding layers, conductive layers, and insulating fillers, where the conductive layers form a trench structure to shield against EMI, with the first conductive layer connecting to the grounding pad and the second conductive layer covering the molding layers and insulating filler, effectively reducing EMI influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If electronic components are electrically connected with the wiring board to enable signal transmission, then communication functionality is improved, but electro-magnetic interference is generated that affects normal operation
Solution Approach 1:
A conductive layer is introduced as an intermediary shielding structure between the electronic components and the external environment. This conductive layer acts as a mediator that blocks EMI from reaching the electronic components while allowing the components to maintain their electrical connections and signal transmission functionality.
Solution Approach 2:
The conductive shielding layer is positioned in advance to prevent EMI from affecting the electronic components before the interference can disrupt normal operation. The shielding structure is designed to counteract EMI effects proactively rather than reactively.
2Reliability
If a shielding structure is added to protect against EMI, then operational reliability is improved, but device complexity increases
Solution Approach 1:
The conductive shielding layer is merged with the existing circuit board structure. The shielding layer is integrated into the circuit board's layered construction, combining the shielding function with the structural support and electrical connection functions already present in the circuit board design.
Solution Approach 2:
The conductive layer serves multiple functions simultaneously: it provides EMI shielding, maintains electrical connections through vias, and integrates with the circuit board's structural framework. This multi-functionality reduces the need for separate dedicated shielding components.
3Object-affected harmful factors
If the grounding pad is exposed to connect the conductive layer, then EMI shielding effectiveness is improved, but the grounding pad is more susceptible to external contamination
Solution Approach 1:
The grounding pad is nested within the circuit board structure, with the conductive shielding layer positioned above it. The grounding pad remains exposed vertically for electrical connection but is laterally protected by the surrounding circuit board layers and shielding structure, creating a nested configuration that provides both access and protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described structure effectively shields electronic components from EMI, enhancing their operational reliability and reducing the impact of thermal expansion, thereby improving the module's performance and stability.
Implementation Method 1
the first conductive layer and the second conductive layer are taken as the electro-magnetic interference shielding structure, so as to prevent the operation of the electronic components from the influence of the electro-magnetic interference
Implementation Method 2
The first conductive layer covers the side wall of the trench and the grounding pad, and the first conductive layer electrically connects with the grounding pad
Data Source
AI summary
An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.