Compartment EMI Shielding Using Segmented Wire Grids
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Solution Overview
Problem
Current EMI shielding solutions for system-in-a-package (SiP) modules, such as electrically-conductive metal cans, are impractical due to space constraints and inefficiency in reducing EMI emissions within the module package, particularly affecting RF functional blocks.
Innovation Solution
A compartment EMI shielding solution using a set of electrically-conductive wires surrounding and extending over circuitry within the module package, connected to a common electrical ground structure, with specific spacings and orientations to attenuate specific frequency ranges, functioning as a Faraday cage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electrically-conductive metal cans are used for EMI shielding, then EMI shielding effectiveness is improved, but device size and space utilization deteriorate
Solution Approach 1:
The patent divides the continuous metal can shield into discrete wire elements arranged in parallel configurations. These segmented wire shields maintain EMI attenuation effectiveness while occupying significantly less space within the module package, directly resolving the contradiction between shielding effectiveness and device size.
Solution Approach 2:
The patent employs thin wire structures instead of bulky metal cans. The wire-based shield acts as a flexible, space-efficient barrier that provides EMI shielding through its geometric configuration and electrical connectivity to ground, rather than relying on the volume of a solid enclosure.
2Object-affected harmful factors
If electrically-conductive metal cans are used for EMI shielding, then EMI shielding effectiveness is improved, but space constraints in compact environments worsen
Solution Approach 1:
By segmenting the shield into discrete wire elements, the design achieves EMI protection without requiring the continuous enclosure of a metal can. This segmentation allows the shield to adapt to compact SiP geometries and fit within tight space constraints while maintaining shielding effectiveness.
Solution Approach 2:
The patent transitions from a three-dimensional metal can enclosure to a two-dimensional wire grid configuration. This dimensional change allows the shield to provide effective EMI protection with minimal volume occupation, enabling adaptation to space-constrained environments like smartphone SiP modules.
3Object-generated harmful factors
If compartment EMI shielding is implemented, then EMI emissions within module package are reduced, but manufacturing complexity increases
Solution Approach 1:
The wire elements serve dual functions: they provide EMI shielding when connected to ground, and they can be integrated with existing PCB trace structures. This multi-functionality reduces manufacturing complexity by combining shielding functionality with existing structural elements rather than adding completely separate components.
Solution Approach 2:
The patent merges the EMI shield wires with the PCB ground structure and existing circuit traces. By combining the shielding function with existing structural and electrical elements, the design achieves compartment EMI shielding without requiring entirely separate manufacturing processes or additional complex assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI emissions between RF functional blocks, improving shielding by 2 to 7 dB for frequencies ranging from 1.9 GHz to 2.5 GHz, while maintaining a low profile and being compact, thus addressing space and efficiency concerns.
Implementation Method 1
A compartment EMI shielding solution using a set of electrically-conductive wires surrounding and extending over circuitry within the module package, connected to a common electrical ground structure, with specific spacings and orientations to attenuate specific frequency ranges, functioning as a Faraday cage.
Data Source
AI summary
A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.