EMIB Backside Power Delivery for Multi-Die Package Interconnects
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Solution Overview
Problem
Integrated circuit packages with embedded multi-die interconnect bridges (EMIBs) face limitations in power delivery capability compared to other interposer technologies, particularly due to the difficulty in providing vertical power distribution to microbumps, which reduces power efficiency and increases manufacturing complexity.
Innovation Solution
The integration of a silicon die embedded within the package substrate with a conductive path and through-silicon vias that extend from the back side to the front side, allowing for power and data signal transfer between integrated circuit dies, and the use of a patterned adhesive layer to accommodate conductive pads, enabling efficient vertical power distribution from the printed circuit board to the EMIB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional EMIB structures are used to interconnect integrated circuit dies, then integration density is improved, but power delivery capability deteriorates due to limited vertical power distribution to microbumps
Solution Approach 1:
The patent introduces a conductive layer positioned at the back side of the EMIB, creating a new vertical dimension for power distribution. This back-side conductive path enables power to be delivered from the substrate through the EMIB to the microbumps, adding a vertical power delivery dimension that complements the traditional lateral signal interconnect function of the EMIB.
Solution Approach 2:
The patent segments the power delivery function from the signal interconnect function by introducing separate conductive paths. The front side of the EMIB handles signal interconnection between dies, while the back side conductive layer handles power distribution, allowing each function to be optimized independently without interfering with the other.
2Power
If vertical power distribution paths are added to EMIB, then power delivery efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the power distribution function with the existing EMIB structure by integrating a conductive layer into the back side of the EMIB. This conductive layer is formed using the same fabrication processes already employed for creating the EMIB interconnect structure, thereby adding power delivery capability without requiring entirely new manufacturing equipment or processes.
Solution Approach 2:
The EMIB structure is designed to serve multiple functions: lateral signal interconnection between dies through the front side, and vertical power distribution through the back side conductive layer. This multi-functionality reduces the need for separate dedicated power delivery structures, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances power delivery efficiency by allowing direct vertical power distribution to microbumps, reducing power loss and manufacturing complexity, while maintaining high-density interconnects between integrated circuit dies.
Implementation Method 1
The package substrate may include a conductive path that is electrically coupled to the EMIB from the back side of the EMIB and that supplies power to the EMIB
Implementation Method 2
A patterned adhesive layer may be applied to the conductive layer before the EMIB is mounted on the conductive layer
Data Source
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AI summary
Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include at least two integrated circuit dies that communicate using an embedded multi-die interconnect bridge (EMIB) in a substrate of the multi-chip package. The EMIB may receive power at contact pads formed at a back side of the EMIB that are coupled to a back side conductor on which the EMIB is mounted. The back side conductor may be separated into multiple regions that are electrically isolated from one another and that each receive a different power supply voltage signal or data signal from a printed circuit board. These power supply voltage signals and data signals may be provided to the two integrated circuit dies through internal microvias or through-silicon vias formed in the EMIB.