EMIB Package Barrier Layers for Uniform Mixed-Pitch Bump Heights
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Solution Overview
Problem
The integration of multiple dies in electronic packages with non-uniform pitches leads to bump height variations, causing reliability issues during thermal compression bonding and requiring different barrier layer stack-ups to manage varying power requirements across interconnects.
Innovation Solution
The implementation of packaging architectures with barrier layers of varying thickness and composition over pads with non-uniform pitches to correct bump standoff height variations, ensuring minimal height variation and improved reliability through tailored interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple dies are integrated with non-uniform pitches in an electronic package, then functionality and integration density are enhanced, but bump height variation increases causing assembly and reliability issues
Solution Approach 1:
The patent applies local quality by providing different barrier layer stack-ups at different locations on the package substrate. Specifically, first barrier layers with a first stack-up are provided at first locations, while second barrier layers with a second stack-up are provided at second locations. This allows each region to be optimized for its specific pitch requirements, compensating for the non-uniform pitch variations and achieving uniform bump heights across the entire package.
2Manufacturing precision
If different barrier layer stack-ups are used to accommodate non-uniform pitches, then bump height uniformity is improved, but device complexity increases
Solution Approach 1:
The patent segments the package substrate into multiple regions with different barrier layer configurations. The substrate is divided into first locations and second locations, each with appropriately tailored barrier layers. This segmentation allows the complex requirement of uniform bump heights across non-uniform pitches to be broken down into manageable regional solutions, making the overall system more controllable and manufacturable.
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.