EMIB Bridge Power Rails for Lower Resistance and Inductance
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Solution Overview
Problem
EMIB architectures face limitations in power delivery due to the bridge preventing direct vertical access, leading to higher resistance and AC inductance as current travels horizontally along traces on the package substrate.
Innovation Solution
Incorporating an additional routing layer with increased thickness within the bridge to provide dedicated power rails, reducing resistance and AC inductance, and allowing for multiple power rails to be accessible.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current travels horizontally along traces on the package substrate to deliver power, then power can be delivered to the dies, but DC resistance and AC inductance increase
Solution Approach 1:
The patent introduces a vertical dimension to power delivery by creating through-bridge vias that extend vertically through the bridge structure. This allows power to travel vertically from the package substrate through the bridge to the dies, eliminating the need for horizontal traces and thereby reducing DC resistance and AC inductance while improving power delivery quality.
2Reliability
If through bridge vias are added to provide direct vertical access, then power delivery is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent makes the routing stack multi-functional by enabling it to serve both signal routing and power delivery functions. By integrating power delivery capabilities into the existing routing stack structure, the design eliminates the need for separate through-bridge vias, thereby maintaining improved power delivery quality while avoiding significant manufacturing cost increases.
3Area of stationary object
If the bridge prevents access to overlying dies from below, then EMIB architecture achieves high IO count per millimeter and small area, but power delivery path becomes indirect
Solution Approach 1:
The patent resolves the space efficiency versus power delivery efficiency contradiction by utilizing the vertical dimension. The routing stack is configured to provide vertical power delivery paths through the bridge structure, allowing power to be delivered directly from below without requiring additional horizontal space. This maintains the compact package area while achieving efficient power delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The additional routing layer decreases DC resistance and current density, reduces voltage drop, and improves power integrity by enabling efficient power delivery and reducing transient noise and voltage droop.
Implementation Method 1
the second routing layer has a second thickness that is greater than the first thickness... decreases DC resistance
Implementation Method 2
reducing resistance and AC inductance
Data Source
AI summary
Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.