Embedded Bridge Interconnect Assembly for 30 Micron EMIB Routing
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Solution Overview
Problem
Existing integrated circuit (IC) product architectures require separate packages for different functions, leading to increased system board area, power loss, and cost.
Innovation Solution
A package assembly with an embedded bridge interconnect assembly, where a package substrate includes dies mounted on its surface and an embedded bridge that routes electrical signals between the dies, reducing the need for separate packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If separate packages are used for different functions (CPU logic, graphics functions, cache memory), then device complexity and number of components are reduced, but system board area, power loss, and cost increase
Solution Approach 1:
The patent merges multiple separate functional packages (CPU, graphics, cache memory) into a single integrated package assembly. The package substrate integrates multiple dies including processor die, graphics processing die, and memory die, along with an embedded bridge interconnect assembly, all within one package. This consolidation reduces the number of separate components on the system board while maintaining functional separation and performance benefits.
2Device complexity
If separate packages are used for different functions, then device complexity is reduced, but power loss increases
Solution Approach 1:
The embedded bridge interconnect assembly acts as an intermediary that enables direct electrical interconnection between the processor die, graphics processing die, and memory die within the integrated package. This bridge provides high-speed data transfer paths that reduce signal transmission distance and power consumption compared to separate packages, while maintaining the functional modularity of individual dies.
3Ease of manufacture
If separate packages are used for different functions, then ease of manufacture is improved, but cost increases
Solution Approach 1:
The patent combines multiple functional dies and the embedded bridge interconnect assembly into a single package assembly that is manufactured as one integrated unit. The package substrate is formed with embedded conductive vias and interconnect structures that electrically connect the different dies, eliminating the need for separate packaging and interconnection processes for each component. This integration reduces overall manufacturing cost despite the increased complexity of the manufacturing process.
Data Source
AI summary
A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.