EMIB Power Delivery via Central Flood Plain and Segmented Domains
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Solution Overview
Problem
Semiconductor device miniaturization poses challenges in achieving high-speed and small volume interconnects between dice, and effectively delivering power to these interconnected devices while managing inductive-loop and electromagnetic noise issues.
Innovation Solution
The implementation of an embedded multi-die interconnect bridge (EMIB) architecture with a power flood plain for central power delivery and peripheral power introduction, utilizing micro-via arrays and metallization layers to route power and ground connections efficiently, and supplementing power delivery with additional power at the periphery of the EMIB die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor devices are miniaturized to achieve small volume interconnects, then device size is reduced, but power delivery becomes more difficult and inductive-loop noise increases
Solution Approach 1:
The patent divides the power delivery system into multiple independent power domains within the EMIB die, with separate power and ground rails for different functional regions. This segmentation reduces the size of individual current loops, thereby minimizing inductive noise while maintaining effective power delivery to miniaturized devices
Solution Approach 2:
The patent implements localized power delivery through centrally-located power introduction points that distribute power to specific regions of the EMIB die. Each power domain has optimized power and ground rail configurations tailored to its specific noise and power requirements, reducing overall inductive noise while supporting device miniaturization
2Speed
If high-speed interconnects are implemented between dice, then data transmission speed is improved, but electromagnetic noise and inductive-loop issues worsen
Solution Approach 1:
The patent creates equipotential power domains by carefully managing power and ground rail connections across the EMIB die. By maintaining consistent potential references in high-speed signal paths, the design reduces electromagnetic noise while enabling high-speed data transmission between interconnected devices
Solution Approach 2:
The EMIB die itself acts as an intermediary structure that provides controlled impedance paths and isolated power domains for high-speed interconnects. The metallization layers and via structures serve as mediators that manage signal integrity and reduce electromagnetic interference while maintaining high transmission speeds
3Adaptability or versatility
If power is delivered centrally to the EMIB die, then power distribution flexibility is improved, but inductive current looping increases
Solution Approach 1:
The patent segments the centrally-delivered power into multiple isolated power domains within the EMIB die. Each domain has its own localized ground return path, which prevents formation of large inductive current loops while maintaining the flexibility of central power introduction for adaptable distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables enhanced power delivery and noise management, allowing for flexible power distribution and reduced inductive current looping and electromagnetic noise between power and ground rails, thereby supporting efficient operation of interconnected semiconductor devices.
Implementation Method 1
metallization layers to route power and ground connections efficiently
Implementation Method 2
reduced inductive current looping and electromagnetic noise between power and ground rails
Data Source
AI summary
An embedded multi-die interconnect bridge (EMIB) die is configured with power delivery to the center of the EMIB die and the power is distributed to two dice that are interconnected across the EMIB die.