Emitter Cavity Reduces Thermal Coupling
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Solution Overview
Problem
Existing infrared emitters face inefficiencies due to thermal coupling between the emitting element and the semiconductor substrate, leading to increased thermal losses and decreased efficiency.
Innovation Solution
A semiconductor substrate with a cavity adjacent to its main surface is used to form a support structure for the emitting element, reducing thermal coupling through the use of insulating layers and sacrificial materials, and further cavities are arranged to minimize convection and thermal conduction losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the emitting element is directly coupled to the semiconductor substrate, then the structural support and electrical connection are ensured, but thermal losses increase due to strong thermal coupling
Solution Approach 1:
The semiconductor substrate is segmented by forming a cavity beneath the emitting element, dividing the substrate into an upper portion providing structural support and a lower portion removed to create thermal isolation. This segmentation reduces thermal coupling while maintaining mechanical stability through the remaining substrate structure.
Solution Approach 2:
A cavity is extracted from the semiconductor substrate by removing a portion of the substrate material beneath the emitting element. This extraction creates thermal isolation by eliminating the direct thermal conduction path, thereby reducing thermal losses from the emitting element to the substrate.
2Loss of energy
If a cavity is formed in the semiconductor substrate to reduce thermal coupling, then thermal losses are reduced, but the manufacturing complexity increases
Solution Approach 1:
The cavity is formed as a preliminary step during the substrate preparation phase, before the emitting element is fabricated or mounted. By pre-forming the cavity in the substrate, the subsequent steps of emitting element fabrication and assembly are simplified, and thermal isolation is achieved without adding complexity to the main manufacturing process.
3Loss of energy
If insulating layers are added to reduce thermal coupling, then thermal losses are reduced, but the device structure becomes more complex
Solution Approach 1:
An insulating layer is introduced as an intermediary between the emitting element and the semiconductor substrate. This insulating layer acts as a thermal barrier, mediating the thermal interaction by blocking heat conduction paths while allowing the emitting element to remain structurally supported. The insulating layer can be integrated into existing fabrication processes, minimizing additional structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the efficiency of the emitter by reducing thermal losses and allowing for more precise control of thermal radiation emission, improving the overall performance compared to conventional designs.
Implementation Method 1
the cavity provides a reduction of a thermal coupling between the emitting element and the semiconductor substrate
Implementation Method 2
the emitting element being configured to emit a thermal radiation of the emitter
Data Source
AI summary
A method for manufacturing an emitter comprises providing a semiconductor substrate having a main surface, the semiconductor substrate comprising a cavity adjacent to the main surface. A portion of the semiconductor substrate arranged between the cavity and the main surface of the semiconductor substrate forms a support structure. The method comprises arranging an emitting element at the support structure, the emitting element being configured to emit a thermal radiation of the emitter, wherein the cavity provides a reduction of a thermal coupling between the emitting element and the semiconductor substrate.