Light Emitting Module IC Integration for Tiny Terminal Routing

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Solution Overview

Problem

There is no technical solution to effectively arrange terminals for leading wires from small light emitting devices and control them.

Innovation Solution

A light emitting module comprising a light emitting structure, an Integrated Circuit (IC), and an IC input structure, where the IC output terminals are electrically connected to the light emitting unit input terminals through a semiconductor-formed electrical connection layer, allowing for the transmission of driving inputs to the light emitting units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of light emitting devices is reduced to very small dimensions, then the display resolution and density are improved, but the arrangement and control of terminals for leading wires becomes impossible

Engineering Contradiction:
Improvesize of light emitting devicesVSAvoidarrangement and control of terminals
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The patent merges the IC and its input structure into a single integrated component. The IC main body is directly formed on the light emitting structure, and the IC input terminals are integrated with the light emitting unit input terminals, eliminating the need for separate terminal arrangements and wire connections that would be impossible at very small scales.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The IC is nested directly on the light emitting structure, with the IC main body formed on the light emitting unit layer. The IC input terminals are nested with the light emitting unit input terminals, creating a compact hierarchical structure that enables control of miniaturized light emitting devices.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Extent of automation

If traditional separate IC and terminal arrangement methods are used, then the control functionality is achieved, but the device complexity and manufacturing difficulty increase when scaling down

Engineering Contradiction:
Improvecontrol functionalityVSAvoidterminal arrangement structure
Core Design Contradiction:
Extent of automationVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into unified structures: the IC input terminals are merged with the light emitting unit input terminals, and the IC is directly formed on the light emitting structure. This integration simplifies the overall device structure and reduces manufacturing complexity while maintaining full control functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The input terminals serve dual functions: they act as both IC input terminals for controlling the IC and as light emitting unit input terminals for driving the light emitting devices. This multi-functionality reduces the number of separate components and simplifies the terminal arrangement structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Extent of automation

If conventional wire leading methods are used, then the light emitting devices can be controlled, but the manufacturing precision and reliability deteriorate at very small scales

Engineering Contradiction:
Improvecontrol of light emitting devicesVSAvoidterminal connection precision
Core Design Contradiction:
Extent of automationVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical wire leading and physical terminal connections with a direct semiconductor fabrication approach. The IC is formed using semiconductor processes directly on the light emitting structure, and electrical connections are established through integrated conductive paths, eliminating the need for precise mechanical wire placement and connection that becomes impossible at very small scales.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental parameter of connection method from mechanical/wire-based to semiconductor-fabrication-based. By transitioning to direct formation of the IC and its terminals through semiconductor processes, the manufacturing precision requirement shifts from mechanical alignment to semiconductor-level fabrication, which is well-established and reliable.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20230299250A1Light emitting module and display device
Publication Date: 2023.09.21 BEIJING IVISUAL 3D TECH CO LTD
  • US20230299250A1 patent drawing
  • US20230299250A1 patent drawing
  • US20230299250A1 patent drawing

AI summary

Provided is a light emitting module, including: a light emitting structure, an IC and an IC input structure; where, the IC input structure is configured to transmit an IC driving input for driving the IC to the IC; a plurality of IC output terminals included in the IC are configured to transmit light emitting unit driving inputs for driving the light emitting structure to the light emitting structure; and the light emitting structure is configured to receive the light emitting unit driving inputs by a plurality of light emitting unit input terminals. By the light emitting module provided by the present application, terminals for leading wires from light emitting devices may also be effectively arranged, and the light emitting devices may be accordingly controlled even if a size of the light emitting devices is very small. Also provided is a display device.