Emitter Sense Terminal Layout for Compact Power Modules

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Solution Overview

Problem

Conventional power semiconductor devices face challenges in downsizing due to complex wiring and limited space on insulating substrates, and external mounting of main electrode emitter sense terminals compromises insulation properties and operability.

Innovation Solution

The power semiconductor device features main electrode emitter sense terminals directly connected to main electrodes and partially exposed outside the module, with a diagonal layout to minimize external spacing and improve insulation design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the main electrode emitter sense terminal is connected to a circuit pattern on an insulating substrate and led outside the module, then the module can be downsized, but the wiring becomes complicated and the space on the insulating substrate is limited

Engineering Contradiction:

Improvemodule sizeVSAvoidwiring complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The main electrode emitter sense terminal is extracted from the insulating substrate wiring system and directly connected to the main electrode. This eliminates the need for complex circuit patterns on the insulating substrate, simplifying the wiring while still allowing the terminal to be led outside the module for compact sizing.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The sense terminal is routed through a third dimension by passing it through the case opening rather than confining it to the two-dimensional insulating substrate plane. This dimensional transition allows the terminal to exit the module without requiring complex lateral wiring arrangements on the substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the main electrode emitter sense terminal is externally mounted on the module, then the module can be downsized, but the insulation properties are reduced

Engineering Contradiction:

Improvemodule sizeVSAvoidinsulation properties

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The case acts as an intermediary insulating barrier between the internally connected sense terminal and the external environment. The terminal passes through the case opening, which provides insulation through the case material itself, maintaining insulation properties while allowing external access for compact module design.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If the main electrode emitter sense terminal is externally mounted on the module, then the module can be downsized, but the operability is reduced due to additional mounting operations

Engineering Contradiction:

Improvemodule sizeVSAvoidmounting operation

Core Design Contradiction:

Volume of moving objectVSEase of operation

Solution Approach 1:

The sense terminal is integrated into the module structure during manufacturing, with the case opening providing automatic alignment and positioning. The terminal passes through the case opening in a self-aligning manner, eliminating the need for separate mounting operations and simplifying assembly while maintaining compact dimensions.

Inventive Principle:

Principle #25Self-service

4Ease of operation

If the main electrode emitter sense terminal is simply led out from the main electrode, then the operability is improved, but an insulation design is necessary and the module cannot be downsized

Engineering Contradiction:

Improveterminal accessVSAvoidmodule size

Core Design Contradiction:

Ease of operationVSVolume of moving object

Solution Approach 1:

The sense terminal routing is merged with the case structure by passing the terminal through the case opening. This integration combines the terminal access function with the case's structural and insulating functions, achieving simple terminal access without requiring additional insulation components that would increase module size.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12308305B2Power semiconductor device

Publication Date: 2025.05.20 MITSUBISHI ELECTRIC CORP

AI summary

An object of the present invention is to provide a power semiconductor device enabling a downsizing of a module. A power semiconductor device according to the present invention includes: emitter main electrodes each provided in each of a plurality of semiconductor chips; and main electrode emitter sense terminals directly connected to each of the emitter main electrodes and partially exposed outside a module, wherein each of the main electrode emitter sense terminals is located diagonally to each other, and a distance from each of the main electrode emitter sense terminals to each of the emitter main electrodes connected to each of the main electrode emitter sense terminals is smaller than a distance between the main electrode emitter sense terminals in a plan view outside the module.