eMMC Burn-In Test via Command Line Grounding

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Solution Overview

Problem

Conventional burn-in test architectures for embedded Multi Media Cards (eMMC) are inadequate for testing heat endurance, as they cannot simulate extreme temperature conditions like an oven or refrigerator.

Innovation Solution

A burn-in method and test board design that writes a test pattern to the eMMC's flash memory, electrically connects a command line to ground to operate the eMMC in a boot state, and performs a burn-in procedure using the test pattern to test multiple blocks, allowing for heat endurance testing and storing a test report for future reference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional burn-in test architecture is used with host and card reader, then basic functionality can be tested, but heat endurance testing cannot be performed

Engineering Contradiction:
Improveheat enduranceVSAvoidtest architecture
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the essential testing functionality from the complex host-card reader architecture and implements it directly in the eMMC device itself through embedded test firmware. This allows heat endurance testing to be performed without requiring external host systems or card readers, thereby enabling reliability testing under extreme temperatures while simplifying the overall test architecture.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The eMMC device performs self-testing through embedded test firmware that can autonomously execute burn-in procedures. The device tests its own flash memory blocks and generates test reports without external intervention, enabling heat endurance testing in standalone mode without requiring host systems or card readers.

Inventive Principle:
Principle #25Self-service

2Reliability

If eMMC is tested in transfer state with host, then basic operations can be verified, but comprehensive reliability testing under extreme conditions is limited

Engineering Contradiction:
Improveflash memory reliabilityVSAvoidtesting conditions
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The test firmware is designed to perform multiple testing functions including heat endurance testing, basic operation verification, and comprehensive reliability assessment. This multi-functional approach allows the same embedded firmware to adapt to various testing conditions and scenarios, from simple functionality checks to rigorous heat endurance testing.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If external host system is required for burn-in test, then test control is centralized, but testing flexibility and heat endurance capability are reduced

Engineering Contradiction:
Improvetest executionVSAvoidheat endurance testing capability
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The eMMC device autonomously executes burn-in tests through embedded test firmware without requiring external host control. This self-service capability enables the device to perform comprehensive reliability testing including heat endurance testing in standalone mode, eliminating the operational constraints imposed by external host systems.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS8667345B2Burn-in method for embedded multi media card, and test board using the same, and embedded multi media card tested by the same
Publication Date: 2014.03.04 SILICON MOTION INC
  • US8667345B2 patent drawing
  • US8667345B2 patent drawing
  • US8667345B2 patent drawing

AI summary

A burn-in method for an embedded Multi Media Card (eMMC), and a test board using the same, and an eMMC tested by the same. The disclosed burn-in method comprises the steps as below: writing a test pattern to a flash memory of the eMMC; electrically connecting a command line of the eMMC to ground to operate the eMMC in a boot state; performing a burn-in procedure on the flash memory when the eMMC is in the boot state and the test pattern is recognized as being contained in the flash memory; and collecting a test report during the burn-in procedure, wherein the test report is stored in the flash memory.