EMR Shield and Spring Plate for Optoelectronic Module EMI Control
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Solution Overview
Problem
Optoelectronic modules face challenges with electromagnetic interference (EMI) due to unintended electromagnetic radiation (EMR) escape and susceptibility, particularly through optical ports and mechanical alignment issues, as well as heat dissipation in high-data-rate communication systems.
Innovation Solution
The integration of an EMR containment assembly comprising an EMR shield with fingers and a mounting spring plate, which biases against the housing and alignment guide to control EMR transmission and apply compressive forces for thermal energy transfer, ensuring proper alignment and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a housing is surrounded by electrically conductive material to limit EMR escape, then electromagnetic interference is reduced, but it becomes difficult to control EMR transmission through required openings such as optical ports
Solution Approach 1:
The housing is segmented into conductive and non-conductive portions, with the conductive housing including integrated conductive seals at optical ports. This segmentation allows the housing to provide EMR shielding while maintaining optical signal transmission through the sealed ports, resolving the contradiction between EMI reduction and operational ease.
Solution Approach 2:
A conductive seal is nested within the optical port structure, creating a layered configuration where the conductive seal is positioned inside the housing at the port location. This nested arrangement enables the seal to block EMR escape through the port while allowing optical signals to pass through the center, simultaneously achieving EMI reduction and maintaining port functionality.
2Reliability
If optical transmitters and receivers are aligned with optical cable connectors, then optical signal transmission is achieved, but mechanical tolerances make alignment particularly difficult when cable connectors are permanently attached without adhesives
Solution Approach 1:
Alignment features are preliminarily built into the housing and cable connector structures during manufacturing, including alignment pins, slots, and guide surfaces. These pre-configured features automatically guide the cable connector into proper alignment with optical transmitters and receivers, eliminating the need for complex post-assembly alignment procedures and ensuring reliable optical signal transmission.
Solution Approach 2:
Alignment features act as intermediary elements between the cable connector and the optical components. These features mediate the connection by providing mechanical guidance and positioning, allowing the cable connector to be permanently attached without adhesives while maintaining precise alignment with the optical transmitters and receivers.
3Power
If transmitters and receivers generate heat during operation, then data transmission function is performed, but heat must be dissipated to avoid overheating and damage of components
Solution Approach 1:
Heat is extracted from the optical components (transmitters and receivers) and transferred to dedicated heat dissipation structures. The housing includes thermally conductive portions and heat dissipation features that are spatially separated from the optical components, allowing heat to be removed from the active data transmission elements and dissipated elsewhere in the housing structure.
Solution Approach 2:
Thermal interfaces and heat dissipation structures serve as intermediary elements between the heat-generating optical components and the housing. These intermediaries facilitate heat transfer from the transmitters and receivers to the housing, which then dissipates the heat to the surrounding environment, enabling continuous data transmission without overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively limits EMR transmission, compensates for manufacturing tolerances, and enhances thermal management within optoelectronic modules, reducing EMI and heat-related damage while maintaining optical alignment and efficient data transfer.
Implementation Method 1
a mounting spring plate attached to the EMR shield... The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module
Implementation Method 2
an EMR shield and a mounting spring plate attached to the EMR shield... effective at limiting the transmission of EMR out of and/or into optoelectronic modules
Implementation Method 3
ensure good thermal contact to a fixed contact surface in a housing for efficient transfer of thermal energy out of the optoelectronic module
Data Source
AI summary
Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.