Dynamic Transaction Card EMV Interface Segmentation
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Solution Overview
Problem
Smart cards with EMV technology face limitations due to the need to carve out space for the EMV chip and processor, restricting the placement and size of other components like displays and sensors, as well as the thickness of the card, due to the specific location requirements for EMV contacts.
Innovation Solution
A dynamic transaction card with an EMV interface that separates the EMV processor from the EMV contacts, using a separate printed circuit board layout with EMV contact patterns on the surface, allowing the processor to be placed freely and optimizing internal component placement, such as relocating the power source and display components, and securing components using reaction injection molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the EMV microprocessor is placed directly beneath the EMV contact patterns, then the EMV interface functionality is achieved, but the placement flexibility of other components (display, sensors, power source) is restricted and the card thickness is increased
Solution Approach 1:
The patent segments the EMV interface into two separate parts: the EMV contact patterns remain on the card surface while the EMV microprocessor is relocated to a different position within the card body. This segmentation allows the contact patterns to maintain their standard location for terminal compatibility while the processor can be positioned optimally for other components like display, sensors, and power source.
Solution Approach 2:
The patent introduces a flexible printed circuit board (FPC) as an intermediary element to connect the EMV contact patterns to the relocated EMV microprocessor. This FPC acts as a mediator that transmits electrical signals between the contact patterns and the processor, enabling the decoupling of their physical locations while maintaining functional connectivity.
2Reliability
If the EMV microprocessor is placed directly beneath the EMV contact patterns, then the EMV interface is functional, but the thickness of the card is increased
Solution Approach 1:
By separating the EMV contact patterns from the EMV microprocessor, the patent eliminates the need for a thick glued assembly directly beneath the contacts. The microprocessor can be positioned in a different plane or location within the card body, reducing the vertical thickness required at the contact area while maintaining EMV functionality through the FPC connection.
Solution Approach 2:
The patent transitions from a vertical stacking arrangement (processor directly beneath contacts) to a distributed spatial arrangement where the processor is positioned in a different location within the card's three-dimensional space. This dimensional reconfiguration allows for optimized component placement that reduces overall card thickness while maintaining all necessary connections.
3Reliability
If the EMV microprocessor is placed directly beneath the EMV contact patterns, then the EMV interface is functional, but the size and location of other components (display, sensors) are restricted
Solution Approach 1:
The patent segments the card's internal space by separating the EMV contact area from the EMV processor location. This creates independent zones where the contact patterns occupy the surface area needed for terminal interaction while the processor is positioned in a different area, freeing up space for display components, sensors, and power source to be optimally positioned without interfering with EMV functionality.
Solution Approach 2:
By utilizing the card's three-dimensional space more effectively and positioning the processor in a different location rather than directly beneath the contacts, the patent creates additional available area on the card surface and within the card body for other components like display, sensors, and power source, thereby increasing the functional area for multifunctional capabilities.
Data Source
AI summary
A dynamic transaction card with EuroPay-Mastercard-Visa (“EMV”) technology that includes an EMV interface connecting EMV contacts and an EMV processor to enable a multifunctional dynamic transaction card. A method of manufacturing a dynamic transaction card with an EMV interface connecting EMV contacts and an EMV processor. A dynamic transaction card with an EMV interface may be manufactured using a separate printed circuit board (PCB) layout with EMV contact patterns placed into the top surface of a molding to create the dynamic transaction card. The edges of the EMV contact patterns would be incorporated through holes, which are trimmed to scallops, to allow for surface mounting. The EMV interface may then include a connection between the EMV contact patterns and the EMV microprocessor such that the EMV microprocessor does not have to be placed directly beneath the EMV contact patterns.