Organic Electronic Encapsulant Composition for Moisture Blocking
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are vulnerable to moisture and oxygen, leading to reduced light emitting efficiency and service life, with existing encapsulation methods facing challenges like mechanical damage, thermal expansion issues, and low productivity due to vacuum deposition requirements, and issues with byproducts and unreacted residues in hermetically sealed structures.
Innovation Solution
A composition for an encapsulant comprising a silicone resin, moisture absorbents, photoinitiators, and a monomer capable of dissolving photoinitiators, which forms a curable system that effectively blocks oxygen and moisture while maintaining process stability and preventing gap changes under pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass cap or metal cap is used for encapsulation, then moisture and oxygen blocking is improved, but mechanical damage and thermal expansion issues occur
Solution Approach 1:
The patent uses a flexible organic encapsulation layer with curved surface geometry instead of rigid glass or metal caps. This flexible film structure eliminates mechanical damage issues while maintaining moisture and oxygen blocking capabilities through proper material selection and layered design.
2Reliability
If inorganic materials are deposited under vacuum by sputtering, then moisture and oxygen blocking is improved, but productivity is reduced due to multilayer deposition requirements
Solution Approach 1:
The patent extracts the encapsulation function from complex multilayer inorganic sputtering processes and implements it through a simpler organic film deposition method. This eliminates the need for multiple vacuum deposition steps while maintaining effective moisture and oxygen barriers.
Solution Approach 2:
The patent replaces the mechanical sputtering deposition process with a different deposition method for organic materials, eliminating the need for vacuum conditions and multilayer structures while achieving comparable or superior encapsulation performance.
3Ease of manufacture
If liquid encapsulation method is used, then ease of manufacture is improved, but byproducts and unreacted residues interrupt device driving and shorten service life
Solution Approach 1:
The patent uses a disposable sacrificial layer (e.g., photoresist) that is completely removed after serving its encapsulation purpose. This eliminates the problem of residual byproducts and unreacted materials that would otherwise interfere with device operation and reduce service life.
Solution Approach 2:
The patent performs preliminary encapsulation using a sacrificial layer that is later removed. This preliminary action allows for easy manufacturing while ensuring no residues remain to affect device performance, as the encapsulation function is transferred to the final structure before the sacrificial material is eliminated.
4Reliability
If metal cap structure with extension portion is used for moisture absorbent, then moisture absorption is improved, but processing difficulty increases due to space expansion
Solution Approach 1:
The patent uses a flexible organic encapsulation film that can accommodate moisture absorbent materials without requiring complex metal cap structures with extension portions. This simplifies processing while maintaining effective moisture absorption capabilities through the flexible film's conformal coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulant composition improves the service life of organic electronic devices by maintaining gap integrity and preventing moisture and oxygen ingress, while offering process stability and efficient curing, thus enhancing the reliability and longevity of the devices.
Implementation Method 1
one or more photoinitiators; and a monomer capable of dissolving the photoinitiators
Data Source
AI summary
A composition for an encapsulant according to an embodiment of the present application comprises: 1) a silicone resin; 2) one or more moisture absorbents; 3) one or more photoinitiators; and 4) a monomer capable of dissolving the photoinitiators.