Encapsulant Corner Openings for Crack-Resistant Semiconductor Packaging
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Solution Overview
Problem
As semiconductor devices become smaller, they face challenges such as cracks within the encapsulant due to increased stress, particularly at the corners of the encapsulant in systems like CoWoS.
Innovation Solution
The introduction of first openings within the encapsulant, specifically designed to relieve stress at the corners, is implemented. These openings can be formed using laser drilling or other patterning methods and can be shaped in various forms such as 'C', 'L', 'H', or triangular shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If semiconductor devices are made smaller in two dimensions, then device density increases, but stress concentration at encapsulant corners increases causing cracks
Solution Approach 1:
The encapsulant is segmented by introducing openings that divide the continuous encapsulant structure into distinct regions. These openings act as stress relief zones that prevent stress propagation across the entire encapsulant, thereby preventing cracks while maintaining the overall structural integrity of the smaller semiconductor device package.
Solution Approach 2:
The encapsulant structure is modified locally at critical stress concentration points (corners) by introducing openings in specific patterns and locations. This local modification allows the encapsulant to maintain its protective function in non-stress areas while providing stress relief precisely where needed at the corners and edges of the encapsulant.
2Reliability
If openings are introduced in the encapsulant to relieve stress, then crack prevention improves, but manufacturing complexity increases
Solution Approach 1:
The openings in the encapsulant are designed with specific parameter ranges including area占比 of 1-10% of the encapsulant surface area, opening sizes of 10-100 micrometers, and spacing of 50-200 micrometers. By optimizing these parameters, the design achieves effective stress relief while maintaining manufacturing feasibility and avoiding excessive complexity in the encapsulant structure.
3Reliability
If multiple openings are formed in the encapsulant, then stress distribution improves, but manufacturing time increases
Solution Approach 1:
The openings in the encapsulant are formed as part of the encapsulant fabrication process itself, rather than as a separate post-processing step. This preliminary action integrates the opening formation into the existing manufacturing workflow, allowing stress relief features to be created during normal production without adding significant time to the overall manufacturing cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The formation of these openings reduces or eliminates stress-related cracks at the corners of the encapsulant, thereby enhancing the reliability and yield of semiconductor devices, especially in larger organic interposer configurations.
Implementation Method 1
These openings can be formed using laser drilling or other patterning methods
Data Source
AI summary
Semiconductor devices and methods of manufactured are presented in which a first redistribution structure is formed, semiconductor devices are bonded to the first redistribution structure, and the semiconductor devices are encapsulated in an encapsulant. First openings are formed within the encapsulant, such as along corners of the encapsulant, in order to help relieve stress and reduce cracks.