Semiconductor Encapsulant Microwave Curing to Reduce Package Warpage

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Solution Overview

Problem

The semiconductor industry faces challenges in mass production due to thermal curing processes causing warpage and damage from differential thermal expansion of materials, and existing laser-assisted heating technologies are limited in scalability.

Innovation Solution

A method using microwave radiation to cure encapsulants on semiconductor devices, employing a semiconductor device magazine with high reflectivity to trap electromagnetic waves and heat the encapsulant directly, reducing thermal stress and enabling efficient mass production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If convective heat transfer is used to cure the encapsulant, then the encapsulant can be cured, but the entire semiconductor package is heated causing warpage and damage due to differential thermal expansion

Engineering Contradiction:

Improveencapsulant curingVSAvoidwarpage and damage from differential thermal expansion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The heating process is segmented to target only the encapsulant material rather than heating the entire semiconductor package. The microwave radiation is selectively absorbed by the encapsulant, curing it in place without subjecting other components to thermal stress from differential expansion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heating action is localized to the encapsulant region only. By using microwave radiation that is selectively absorbed by the encapsulant material, the curing process occurs locally without heating adjacent electronic components, thereby preventing warpage and thermal damage.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If laser assisted heating technology is used to cure the encapsulant, then targeted heating is achieved, but mass production capability is limited

Engineering Contradiction:

Improvetargeted heating of encapsulantVSAvoidmass production capability

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

The microwave heating system is designed to handle multiple semiconductor packages simultaneously in a mass production configuration. The magazine structure allows for batch processing of multiple devices, providing both targeted heating capability and mass production throughput.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The mechanical laser positioning system is replaced with a microwave radiation system that can treat multiple packages simultaneously. This substitution enables parallel processing in the magazine, significantly improving productivity while maintaining targeted heating of encapsulants.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If the entire semiconductor package is heated for encapsulant curing, then the encapsulant can be cured, but stresses form due to different coefficients of thermal expansion of materials

Engineering Contradiction:

Improveencapsulant curingVSAvoidthermal stress from differential expansion

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Microwave radiation serves as an intermediary heating mechanism that selectively targets the encapsulant material. This intermediary approach allows curing to occur without direct thermal contact or convective heating of the entire package, eliminating the source of differential thermal expansion stresses.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The microwave curing process achieves efficient and uniform heating of encapsulants without damaging adjacent components, enhancing production efficiency and reducing warpage, suitable for high-throughput manufacturing.

Implementation Method 1

irradiating the encapsulant with a microwave radiation to cure the encapsulant

Methodology Applied

Scientific EffectDielectric heating: Dielectric Heating

Implementation Method 2

employing a semiconductor device magazine with high reflectivity to trap electromagnetic waves

Methodology Applied

Scientific EffectElectromagnetic reflection: Reflection

Data Source

PatentUS20250364275A1Method and apparatus for forming semiconductor device

Publication Date: 2025.11.27 JCET STATS CHIPPAC KOREA LTD

AI summary

A method and an apparatus for forming a semiconductor device are provided. The method includes: providing a substrate; mounting at least one electronic component on a surface of the substrate; forming an encapsulant on the surface of the substrate to encapsulate the electronic component; loading the substrate into a semiconductor device magazine; and irradiating the encapsulant with a microwave radiation to cure the encapsulant.