Encapsulant Module Opaque Coating Light Blocking
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Solution Overview
Problem
Conventional image sensor devices require additional assembly processes and increased volume due to polymeric or metallic encapsulants, leading to higher costs and limitations in miniaturization, and precise alignment issues during assembly result in low assembly yields.
Innovation Solution
An encapsulant module with an outer frame, optical elements, and an opaque coating that overlies the frame, eliminating the need for separate encapsulants and enabling precise alignment through the coating's formation over the frame and aperture openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a polymeric or metallic encapsulant is assembled to the image sensor device to prevent unwanted light incidence, then light blocking function is improved, but device volume increases and assembly cost increases
Solution Approach 1:
The patent merges the encapsulant and the light-blocking coating into a single integrated structure. The encapsulant includes an enclosing wall with an opaque coating formed directly on its outer surface, eliminating the need for separate encapsulant and light-blocking components. This integration reduces device volume while maintaining both mechanical protection and light blocking functions.
Solution Approach 2:
The encapsulant is designed to perform multiple functions simultaneously: mechanical protection of the image sensor device, structural support, and light blocking through the opaque coating. This multi-functionality eliminates the need for separate dedicated light-blocking components, reducing overall device volume and assembly complexity.
2Object-affected harmful factors
If a polymeric or metallic encapsulant is assembled to the image sensor device to prevent unwanted light incidence, then light blocking function is improved, but assembly cost increases
Solution Approach 1:
The encapsulant and light-blocking coating are manufactured as a single integrated component, eliminating separate assembly steps for attaching a dedicated light-blocking element. The opaque coating is formed directly on the enclosing wall during encapsulant manufacturing, reducing assembly operations and associated costs.
Solution Approach 2:
The opaque coating is formed on the enclosing wall during the encapsulant manufacturing process, before the encapsulant is assembled to the image sensor device. This preliminary formation of the light-blocking function eliminates the need for subsequent assembly steps, reducing assembly cost and complexity.
3Manufacturing precision
If precise alignment between the aperture and the aperture opening of the encapsulant is required to prevent complete or partial coverage, then light blocking precision is improved, but assembly yield decreases due to inability to inspect alignment during front-end assembly
Solution Approach 1:
The opaque coating is selectively formed only on specific portions of the enclosing wall where light blocking is required, while leaving aperture openings exposed. This localized coating approach ensures precise alignment between the aperture and aperture openings without requiring complex alignment inspections, as the coating pattern itself defines the light-blocking regions.
Solution Approach 2:
The aperture openings are defined in the enclosing wall before the opaque coating is formed. This preliminary definition of aperture locations allows the coating process to automatically align with the apertures, eliminating the need for post-assembly alignment inspection and rework, thereby improving assembly yield.
4Volume of moving object
If the volume of the image sensor device is reduced for miniaturization, then device size is improved, but the ability to accommodate separate encapsulant and light-blocking components is worsened
Solution Approach 1:
The encapsulant and light-blocking coating are merged into a single integrated component, eliminating the need for separate dedicated light-blocking elements. This integration significantly reduces device volume while maintaining both mechanical protection and light blocking functions, enabling miniaturization of the image sensor device.
Solution Approach 2:
The encapsulant is designed to perform multiple functions simultaneously: mechanical protection, structural support, and light blocking through the opaque coating. This multi-functionality eliminates the need for additional separate components, reducing device volume and enabling miniaturization while maintaining full functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces device size, prevents unwanted light incidence, and enhances assembly yields by integrating the opaque coating directly with the frame, eliminating the need for separate encapsulants and improving alignment precision.
Implementation Method 1
an opaque coating overlies the enclosing wall
Data Source
AI summary
The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.