Encapsulant Through-Vias for Dense Stacked IC Packaging
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Solution Overview
Problem
The semiconductor industry faces challenges in reducing the size of packaged integrated circuit devices and increasing packaging density, as existing methods for conductively coupling stacked devices are inefficient and occupy significant space.
Innovation Solution
The use of conductive vias that extend through the body of encapsulant material to establish electrical connections between integrated circuit dies, allowing for more compact and densely packed stacked packaged integrated circuit devices, with solder balls or other connections forming conductive paths between the dies and external structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls or wire bonds are used to establish connections between stacked packaged integrated circuit devices, then electrical connectivity between devices is achieved, but the device size increases and packaging density decreases
Solution Approach 1:
The patent merges the connection function into the encapsulant material itself by forming conductive vias through the encapsulant. This integrates the interconnection structure with the packaging material, eliminating the need for separate solder balls or wire bonds, and thereby reducing overall device volume while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions from traditional planar connections (solder balls at the bottom) to three-dimensional vertical connections through the encapsulant body. The conductive vias extend vertically through the encapsulant material, enabling stacked device configuration and improving space utilization in the vertical dimension.
2Reliability
If traditional connection methods (solder balls, wire bonds) are used, then electrical connections are established, but packaging density is reduced
Solution Approach 1:
The connection function is merged with the encapsulant material by forming conductive vias directly through it. This integration eliminates the need for additional connection components and space, thereby increasing packaging density while ensuring reliable electrical connections between stacked devices.
Solution Approach 2:
The patent utilizes vertical dimension for connections through the encapsulant body, allowing devices to be stacked more efficiently. This three-dimensional connection approach enables higher packaging density compared to traditional planar connection methods.
3Productivity
If devices are stacked to conserve plot space, then packaging efficiency improves, but existing connection techniques occupy significant space
Solution Approach 1:
The connection structure is merged with the encapsulant material, eliminating the need for separate connection components. The conductive vias are formed within the encapsulant body, significantly reducing the space occupied by connections and improving overall packaging efficiency.
Solution Approach 2:
The patent implements vertical connections through the encapsulant body, transitioning from horizontal space occupation to vertical space utilization. This dimensional change allows for more compact stacked device configurations and improves packaging efficiency.
Data Source
AI summary
A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.