Encapsulated Array Camera Module for Thin Dust-Protected Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional Chip On Board (COB) technology for camera module assembly faces challenges in achieving a lighter and thinner design due to exposed circuit components and gold wires, leading to issues like dust contamination, increased thickness, and difficulty in maintaining image quality in multi-lens camera modules.
Innovation Solution
A camera module design featuring a photosensitive unit with an encapsulation portion that surrounds the sensor and circuit elements, using molding techniques to enclose connecting elements and circuit components, reducing exposure and enhancing structural strength and heat dissipation, while eliminating the need for additional mounting frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional COB technology is used with exposed circuit components and gold wires, then assembly is simpler, but the camera module thickness increases and image quality deteriorates due to dust contamination
Solution Approach 1:
The patent applies a transparent encapsulation layer (thin film) that covers and seals the circuit board, sensor, and connecting elements. This encapsulation layer acts as a protective barrier that prevents dust and pollutants from contaminating the sensor and circuit components, thereby resolving the contradiction between assembly simplicity and dust contamination protection.
2Ease of manufacture
If circuit components and gold wires are exposed on the circuit board surface, then manufacturing is easier, but the camera module thickness increases
Solution Approach 1:
The patent merges the protective encapsulation layer with the structural support function by designing a integrated encapsulation structure that both seals the internal components and provides mechanical support. This eliminates the need for separate protective housings and mounting frames, thereby reducing the overall camera module thickness while maintaining manufacturing ease.
Solution Approach 2:
The transparent encapsulation layer is designed as a thin film structure that provides protection without adding significant thickness. This thin film encapsulation allows the camera module to achieve a thinner profile compared to conventional designs that require separate protective housings.
3Device complexity
If multiple camera lenses are assembled with exposed circuit components, then device complexity is lower, but image quality deteriorates
Solution Approach 1:
The transparent encapsulation layer creates a controlled clean environment that protects the sensor from dust contamination, thereby maintaining high image quality in multi-lens camera modules. The encapsulation is designed to accommodate multiple lenses while preserving optical performance.
4Ease of manufacture
If circuit components protrude from the circuit board, then assembly is simpler, but structural strength decreases
Solution Approach 1:
The patent combines the protective encapsulation function with structural support by designing an integrated encapsulation structure. This merged structure provides both protection for the circuit components and enhanced structural strength, eliminating the need for separate protective housings while maintaining assembly simplicity.
Data Source
AI summary
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.