Encapsulated Carrier Layout for Flash-Free Package Singulation

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Solution Overview

Problem

Existing packaging solutions face challenges in achieving high device reliability while being simple and quick to manufacture, often resulting in issues like mold flash, bleeding, and burrs during the singulation process.

Innovation Solution

A package design featuring a carrier with lateral extensions that are clamped by an encapsulant tool pin during encapsulation, laterally retracted relative to the encapsulant's sidewall, preventing undesired encapsulant flow and allowing for efficient singulation without sawing through metallic material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the lateral extension is used for clamping during encapsulation, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improveencapsulant flow controlVSAvoidcarrier structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The carrier is segmented into a component mounting area and a lateral extension portion. The lateral extension acts as a separate clamping feature that can be independently engaged by the encapsulant tool pin, allowing precise control of encapsulant flow without complicating the main component mounting structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lateral extension serves as an intermediary element between the encapsulant tool pin and the carrier. It provides a dedicated clamping surface that mediates the force application during encapsulation, improving precision while keeping the overall device structure relatively simple.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If sawing through metallic lateral extension is performed, then singulation precision is improved, but manufacturing time increases

Engineering Contradiction:
Improvesingulation accuracyVSAvoidsingulation speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The lateral extension is deliberately positioned and dimensioned to be excluded from the singulation sawing path. By extracting the metallic material from the cutting zone and leaving only encapsulant material to be cut, the process achieves good singulation precision while dramatically increasing manufacturing speed since encapsulant is softer and faster to cut than metal.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of designing the lateral extension to extend to the edge for easy singulation, the invention inverts the approach by retracting it inward. This creates a scenario where the encapsulant material becomes the primary material for singulation cutting, which is faster and simpler than cutting through metal.

Inventive Principle:
Principle #13The other way round (Inversion)

3Ease of operation

If the lateral extension extends to the vertical sidewall, then ease of operation is improved, but harmful factors increase

Engineering Contradiction:
Improveclamping accessibilityVSAvoidburr formation
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The lateral extension is designed to terminate before reaching the vertical sidewall, creating a preliminary protective action. This retraction prevents the sawing process from cutting through the metallic lateral extension, thereby preemptively avoiding burr formation at the package sidewalls while still providing adequate clamping accessibility during encapsulation.

Inventive Principle:
Principle #9Preliminary anti-action

Data Source

PatentUS20250316566A1Encapsulated package with carrier having retracted lateral extension laterally covered by encapsulant
Publication Date: 2025.10.09 INFINEON TECHNOLOGIES AG
  • US20250316566A1 patent drawing
  • US20250316566A1 patent drawing
  • US20250316566A1 patent drawing

AI summary

A package and method is disclosed. In one example, the package includes a carrier comprising a component mounting area from which a lateral extension extends, the lateral extension being configured for being clamped by an encapsulant tool pin during encapsulation, an electronic component mounted on the component mounting area, and an encapsulant encapsulating at least part of the electronic component and part of the carrier. The lateral extension is laterally retracted with respect to a neighboring vertical sidewall of the encapsulant. The encapsulant laterally covers the lateral extension.