Encapsulated Chip Attach Medium Cavity for Contamination Prevention
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Solution Overview
Problem
Existing packaging methods for electronic chips face challenges in preventing contamination and damage during manufacturing, particularly with thin chips where the chip attach medium can unintentionally flow to active surfaces, causing short-circuits and mechanical damage.
Innovation Solution
Encapsulating the electronic chip with an encapsulant before applying the chip attach medium, forming a cavity between the chip and the encapsulant to contain the medium and prevent unwanted flow, and applying the medium only in the cavity to ensure precise placement and prevent contamination of active surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip attach medium is applied before encapsulation, then the chip can be attached to the carrier, but the chip attach medium may unintentionally flow to active surfaces causing short-circuits and contamination
Solution Approach 1:
The encapsulation is performed before applying the chip attach medium. This preliminary action creates a protective barrier that prevents the chip attach medium from reaching and contaminating the active surfaces of the chip, thereby eliminating the risk of short-circuits while still allowing proper attachment to the carrier.
Solution Approach 2:
The encapsulant acts as an intermediary barrier between the chip attach medium and the chip's active surfaces. By introducing this intermediate layer, the harmful flow of chip attach medium is blocked, protecting the chip while maintaining the attachment function.
2Object-affected harmful factors
If the chip attach medium is applied after encapsulation, then contamination is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
By performing encapsulation as a preliminary step before applying the chip attach medium, the process sequence is optimized to prevent contamination inherently through process design rather than requiring additional protective measures or complex control mechanisms during medium application.
3Manufacturing precision
If thin chips are handled during packaging, then high precision is required, but the risk of mechanical damage increases
Solution Approach 1:
The encapsulant provides beforehand cushioning and mechanical support to thin chips during the packaging process. This protective encapsulation reduces the risk of mechanical damage by distributing stresses and providing structural support, enabling safe handling and precise placement of fragile thin chips.
Solution Approach 2:
The encapsulant acts as a flexible protective shell around the thin chip, providing mechanical strength and protection during handling and attachment operations while allowing the chip to be precisely positioned on the carrier.
Data Source
AI summary
A method of manufacturing a package which comprises encapsulating at least part of an electronic chip by an encapsulant, subsequently covering a part of the electronic chip with a chip attach medium, and attaching the encapsulated electronic chip on a chip carrier via the chip attach medium.