Encapsulated Chip Circuit Structure for Delamination Resistance
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Solution Overview
Problem
The manufacturing process of electronic devices often results in cracked, damaged, or delaminated circuit structures due to thermal expansion coefficient differences between conductive and insulating layers, reducing the reliability of the devices.
Innovation Solution
An electronic device design featuring an encapsulation layer surrounding an electronic component with a protective layer and a circuit structure that includes a conductive layer and insulating layer, where the layers are treated to create a specific step difference and roughness to enhance adhesion and reduce the risk of cracking, along with a method involving surface treatments and flattening processes to achieve these characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing processes are used without surface treatment, then the manufacturing process is simple, but the circuit structure becomes cracked, damaged or delaminated due to thermal expansion coefficient differences
Solution Approach 1:
Surface treatment processes (such as plasma treatment, sandblasting, or chemical etching) are performed preliminarily on the conductive layer and insulating layer before final assembly. This preliminary action modifies the surface properties to enhance adhesion and reduce thermal expansion stress, preventing cracking and delamination that would occur during subsequent manufacturing and operation.
Solution Approach 2:
The surface treatment processes change the physical and chemical parameters of the conductive and insulating layer surfaces. This includes modifying surface roughness, surface energy, and chemical composition to improve interfacial adhesion. The flattened surface with controlled roughness parameters reduces stress concentration and prevents delamination caused by thermal expansion coefficient differences.
2Reliability
If the conductive layer and insulating layer are directly assembled without surface treatment, then the manufacturing process is fast, but adhesion between layers is poor leading to delamination
Solution Approach 1:
Surface treatment is performed as a preliminary step before layer assembly to ensure proper adhesion. This preliminary action creates optimal surface conditions for bonding, preventing delamination issues that would require rework and reduce overall manufacturing efficiency.
Solution Approach 2:
Surface treatment modifies key parameters including surface roughness (creating a flattened surface with controlled micro-roughness), surface energy, and chemical reactivity. These parameter changes enhance the adhesion between conductive and insulating layers, ensuring reliable bonding while maintaining manufacturing efficiency through optimized process parameters.
3Reliability
If no flattened surface is created, then the manufacturing process is simpler, but stress concentration occurs at interface irregularities causing cracking
Solution Approach 1:
A flattening process is performed preliminarily on the conductive layer and insulating layer surfaces before final assembly. This preliminary flattening action removes surface irregularities and creates a uniform interface, preventing stress concentration and cracking that would occur during thermal cycling and mechanical operation.
Solution Approach 2:
The flattening process changes the surface topography parameters, creating a controlled roughness profile that reduces stress concentration. The flattened surface with optimized roughness parameters distributes thermal and mechanical stresses uniformly, preventing crack initiation and propagation at interface irregularities.
Data Source
AI summary
An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically connecting the electronic component. The protective layer has a second surface away from the active surface, and a first step difference between the first surface and the second surface is between 1 and 10 μm.