Encapsulated Chip Device Mounting Provision

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Solution Overview

Problem

Existing electronic devices with embedded chips are challenging to handle and manufacture due to complex assembly processes, requiring improvements in manufacturability and user-friendly handling.

Innovation Solution

An electronic device design featuring a carrier with mounted chips and electric connection structures, partially encapsulated by an encapsulant that exposes part of the connection structure's surface, along with a mounting provision for easy assembly on a periphery device, utilizing either the encapsulant material or a separate reinforcement body for mechanical reinforcement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electric connection structure is fully encapsulated for protection, then reliability is improved, but ease of operation deteriorates due to inaccessibility of connection points

Engineering Contradiction:

Improveprotection of electric connection structureVSAvoidaccessibility of connection structure surface

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The encapsulant selectively encapsulates only certain portions of the electric connection structure, leaving other portions exposed. This local differentiation allows the connection structure to be both protected where needed and accessible where required, resolving the contradiction between reliability and ease of operation

Inventive Principle:

Principle #3Local quality

2Ease of operation

If a separate mounting provision is added for easy assembly, then ease of operation is improved, but device complexity increases

Engineering Contradiction:

Improveassembly on periphery deviceVSAvoidnumber of components

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The mounting provision is integrated directly into the encapsulant material, forming a unified structure rather than being a separate component. This merging reduces device complexity while maintaining the ease of assembly benefit, as the mounting provision becomes an inherent part of the encapsulation process

Inventive Principle:

Principle #5Merging (Combining)

3Device complexity

If the mounting provision is formed by the encapsulant material itself, then device complexity is reduced, but strength deteriorates due to mechanical stress on the encapsulant

Engineering Contradiction:

Improveintegration of mounting provisionVSAvoidmounting strength

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The mounting provision is formed by combining the encapsulant material with a reinforcement body made of mechanically stronger material. This composite structure maintains the low complexity benefit of using the encapsulant while compensating for the encapsulant's mechanical limitations through the reinforcement body

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS9536816B2Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Publication Date: 2017.01.03 INFINEON TECHNOLOGIES AG

AI summary

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.