Encapsulated Component Adhesion via Substrate Mediator
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Solution Overview
Problem
Existing mold components face issues with potting compound adherence to free-standing conductor tracks, particularly on printed circuit boards, leading to potential cracking due to temperature changes.
Innovation Solution
The use of contact bases with μVia-in-Land contact sockets provides electrical connections to electronic components, allowing the potting compound to adhere to the outermost substrate layer without exposing copper surfaces, ensuring proper adhesion and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If free-standing conductor tracks (copper surfaces) are used on the printed circuit board, then electrical connection to electronic components is achieved, but the potting compound cannot adhere properly to these surfaces
Solution Approach 1:
The patent introduces a substrate layer as an intermediary between the copper conductor tracks and the potting compound. This substrate layer serves as a mediator that provides a suitable surface for potting compound adhesion while the copper tracks underneath maintain electrical connections. The substrate layer effectively decouples the adhesion requirement from the electrical connection requirement, allowing both functions to be fulfilled independently.
Solution Approach 2:
The patent segments the electrical connection structure into distinct functional layers: copper conductor tracks for electrical conduction, substrate layers for mechanical support and adhesion, and contact bases for component mounting. This segmentation allows each layer to be optimized for its specific function, with the substrate layer specifically designed to provide a non-copper surface that the potting compound can adhere to.
2Strength
If potting compound adheres to copper surfaces, then electrical connection is maintained, but temperature changes cause overstressing and cracking
Solution Approach 1:
The substrate layer acts as a thermal buffer and mechanical intermediary between the copper conductor tracks and the potting compound. During temperature changes, the substrate layer absorbs and distributes thermal stress, preventing direct stress transfer between the copper and the potting compound that would cause cracking. This intermediary layer protects the bond strength while maintaining reliability under thermal cycling.
3Reliability
If all electronic components are contacted by contact bases on the component, then the outermost substrate layer provides good adhesion surface, but additional manufacturing steps are required
Solution Approach 1:
The patent merges multiple functions into the contact base structure: it serves as both the electrical connection element and the mounting platform for electronic components. By integrating these functions, the design eliminates the need for separate adhesion promoters or surface treatments on copper tracks, simplifying the manufacturing process while ensuring reliable potting compound adhesion to the substrate layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures a longer service life for molded components by preventing adhesion issues and ensuring complete encapsulation, even under temperature changes, thereby reducing the risk of cracking.
Implementation Method 1
A soldered connection is provided between the free contact surface of the contact socket and the electronic component
Data Source
Figure 1
Figure 2~3
AI summary
The present invention relates to a moulded module, comprising at least one conductor track (2), at least one outermost substrate layer (3, 4), which covers the conductor track on an outer side, at least one contact base (6), which is arranged on an outer side of the outermost substrate layer (3, 4) and provides an interfacial connection through the outermost substrate layer (3, 4) to the conductor track (2), at least one electronic component (7), which is in electrical contact on the contact base (6), and an encapsulating compound (11), which at least partially encloses the moulded component from the outside, wherein all the electronic components (7) are in electrical contact by means of contact bases (6).